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  • BDE-WF3200 (BDE WiFi Module Based on CC3200)


    BDE-WF3200 is a Wi-Fi® module series consisting of CC3200R1M2RGC single-chip wireless microcontroller (MCU). This series provides three options: BDE-WF3200A32 (Integrated PCB antenna version), BDE-WF3200AU32 (U.FL connector version) and BDE-WF3200N32 (No antenna version). Customer can choose the suitable version for different application scenario.

    Created for the IoT, the BDE-WF3200 is a wireless MCU module that integrates an Arm® Cortex®-M4 MCU, allowing customers to develop an entire application with one device. With on-chip Wi-Fi, Internet, and robust security protocols, no prior Wi-Fi experience is required for faster development. The BDE-WF3200 integrates all required system-level hardware components including clocks, SPI Flash, and passives into a QFM package for easy assembly and low-cost PCB design.

    The applications MCU subsystem contains an industry-standard Arm® Cortex®-M4 core running at 80 MHz. The device includes a wide variety of peripherals, including a fast parallel camera interface, I2S, SD/MMC, UART, SPI, I2C, and four-channel ADC. The CC3200 family includes flexible embedded RAM for code and data; ROM with external serial Flash bootloader and peripheral drivers; and SPI Flash for Wi-Fi network processor service packs, Wi-Fi certificates, and credentials.

    The Wi-Fi network processor subsystem features a Wi-Fi Internet-on-a chip™ and contains an additional dedicated Arm® MCU that completely off-loads the applications MCU. This subsystem includes an 802.11 b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure Internet connections with 256-bit encryption. The BDE-WF3200 supports station, access point, and Wi-Fi Direct modes. The device also supports WPA2 personal and enterprise security and WPS 2.0. The Wi-Fi Internet-on-a-chip includes embedded TCP/IP and TLS/SSL stacks, HTTP server, and multiple Internet protocols. The power-management subsystem includes integrated DC/DC converters supporting a wide range of supply voltages. This subsystem enables low-power consumption modes, such as the hibernate with RTC mode requiring less than 7 μA of current.

    Key Features


    BDE-WF3200 is a Wi-Fi module consisting of CC3200R1M2RGC single-chip wireless microcontroller (MCU)

    Fully integrated module includes all required clocks, SPI Flash, and passives

    Modular FCC, IC, and CE certifications save customer effort, time, and money

    1.27-mm pitch QFM package for easy assembly and low-cost PCB design

    Applications MCU subsystem:

    Arm® Cortex®-M4 core at 80 MHz

    Embedded memory:

    Integrated serial 32Mbit Flash

    RAM (up to 256KB)

    Peripheral drivers in ROM

    Hardware crypto engine for advanced hardware security including:

    AES, DES, and 3DES

    SHA and MD5

    CRC and Checksum

    8-Bit parallel camera

    One Multichannel Audio Serial Port (McASP) interface with support for I2S format

    One SD (MMC) interface

    32-channel Micro Direct Memory Access (μDMA)

    Two Universal Asynchronous Receivers and Transmitters (UARTs)

    Two Serial Peripheral Interfaces (SPIs)

    One Inter-integrated Circuit (I2C)

    Four General-Purpose Timers (GPTs)

    16-Bit Pulse-Width Modulation (PWM) mode

    One Watchdog Timer Module

    4-channel, 12-bit Analog-to-Digital Converters (ADCs)

    Up to 25 individually programmable GPIO pins

    Wi-Fi network processor subsystem:

    802.11 b/g/n radio, baseband, and medium access control

    TCP/IP Stack

    Eight simultaneous TCP, UDP, or RAW sockets

    Two simultaneous TLS v1.2 or SSL 3.0 sockets

    ARP, ICMP, DHCP, DNS, and mDNS support

    HTTP server with built-in programmable HTML page for over-the-network device configuration

    Powerful crypto engine for fast, secured WLAN connections with 256-bit encryption

    Station, Access Point, and Wi-Fi Direct® Modes

    WPA2 personal and enterprise security

    SimpleLink™ connection manager for managing Wi-Fi security states

    TX power:

    17 dBm at 1 DSSS

    17 dBm at 11 CCK

    13 dBm at 54 OFDM

    RX sensitivity:

    -94 dBm at 1 DSSS

    -87 dBm at 11 CCK

    -73 dBm at 54 OFDM

    Application Throughput:

    UDP: 16 Mbps

    TCP: 13 Mbps

    Power-management subsystem:

    Integrated DC/DC converter with a wide-supply voltage:

    VBAT: 2.3 to 3.6 V

    Low-power consumption at 3.6 V:

    Hibernate with Real-Time Clock (RTC): 7 μA

    Low-Power Deep Sleep: <275 μA

    RX Traffic: 59 mA at 54 OFDM

    TX Traffic: 229 mA at 54 OFDM

    Package and operating conditions:

    1.27-mm pitch, 63-Pin, 20.5-mm × 25-mm (BDE-WF3200A32/BDE-WF3200AU32) and 20.5-mm × 17.5-mm (BDE-WF3200N32) QFM package for easy assembly and low-cost PCB design

    Operating temperature range: -20°C to +70°C

    Additional integrated components:

    40.0-MHz crystal

    32.768-kHz crystal (RTC)

    32-Mbit SPI Serial Flash

    RF filter and passive components


    BDE-WF3200A32: Integrated PCB antenna

    BDE-WF3200AU32: U.FL connector for connecting external antenna

    BDE-WF3200N32: No antenna included, RF pad for connecting external antenna




    Internet-of-Things (IoT)

    Home appliances

    Building automation

    Security systems

    Smart energy

    Internet Gateway

    Industrial control

    Smart Plug and Metering

    Wireless communications




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