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Bluetooth/WiFi Combo - BDE-BW3300xPx series(TI CC3300 2.4GHz Wi-Fi6, -40°C to 105°C)
  • BDE-BW3300xPx series(TI CC3300 2.4GHz Wi-Fi6, -40°C to 105°C)

  • BDE-BW3300xPx is a 2.4-GHz Wi-Fi 6 and Bluetooth Low Energy Combo wireless module based on TI’s 10th generation connectivity combo chip CC3300 which is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This module is ideal for use in cost sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the peak throughput requirement is 50 Mbps maximum at the IP layer. BDE-BW3300xPx could be the best choice for bringing the efficiency of Wi-Fi 6 to embedded device applications with a small PCB footprint and highly optimized bill of materials with lower cost.

    In order to fulfil different integration requirements, BDE provides different options including:

    BDE-BW3300NP1, single antenna port without antenna;

    BDE-BW3300UP1, single antenna port with U.FL connector;

    BDE-BW3300AP1, single antenna with integrated PCB antenna;

    BDE-BW3300NP2, dual antenna ports with antenna diversity without antenna;

    BDE-BW3300UP2, dual antenna ports with antenna diversity with integrated U.FL connector;

    BDE-BW3300AP2, dual antenna with antenna diversity with integrated PCB antenna (TBD).

    Key Features


    Highly optimized Wi-Fi 6 and Bluetooth Low Energy 5.2 system for low cost embedded IoT applications 

    Seamless integration with TI Sitara MPU (Linux) / MCU+ (FreeRTOS) as well as other application processors 

    3-wire or 1-wire PTA for external coexistence with additional 2.4GHz radios (e.g. Thread or Zigbee) 

    Multirole support e.g. STA and AP to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)

    Optional antenna diversity or selection (BDE-BW3300NP2, BDE-BW3300UP2, BDE-BW3300AP2) 

    Operating temperature: -40°C to +85°C

    Wi-Fi 6®

    MAC, Baseband and RF Transceiver with support for IEEE 802.11 a/b/g/n/ax Wi-Fi6

       - Medium access controller (MAC)

    Hardware-based encryption and decryption using supporting WPA2 and WPA3

    TWT and OFDMA for optimal embedded performance

    Application throughput up to 50 Mbps

    Supports 4-bit SDIO and SPI host interfaces

    Bluetooth® Low Energy 5.2

    - Bluetooth 5.2 supporting long-range and highspeed PHYs (up to 2 Mbps)

    - Host controller interface (HCI) transport for Bluetooth with option for shared SDIO or UART

    - Bluetooth Low Energy certified stack

    Integrated 2.4G-Hz PA for complete wireless solution with up to +20dBm output power


    - Secured host interface

    - Firmware authentication

    - Anti-rollback protection

    Power Management

    - VDD_1V8: 1.62 V - 1.98 V

    - VDD_3V3: 2.1 V - 4.2 V 

    Clock Source:

    - On module 40 MHz XTAL fast clock

    - External 32.768-kHz slow clock by default


    - 64-QFM, 13.4-mm x 13.3-mm x 2-mm (BDE-BW3300NP1, BDE-BW3300NP2)

    - 64-QFM, 18.4-mm x 13.3-mm x 2-mm (BDE-BW3300UP1, BDE-BW3300UP2, BDE-BW3300AP1)

    - Pin to Pin Compatible with TI’s WL1837MOD

    - Pin to Pin Compatible with BDE’s BDE-BW2837

    Regulatory (In Progress)

    - FCC

    - IC

    - CE-RED


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