General Description
BDE-BW3301NPxM2 is a 2.4-GHz Wi-Fi 6 and Bluetooth Low Energy Combo wireless M.2 card based on TI’s 10th generation connectivity combo chip CC3301 which is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This module is ideal for use in cost sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the peak throughput requirement is 50 Mbps maximum at the IP layer. BDE-BW3301NPxM2 could be the best choice for bringing the efficiency of Wi-Fi 6 to embedded device applications with a small PCB footprint and highly optimized bill of materials with lower cost. The module integrates a BDE module (BDE-BW3301NP1 or BDE-BW3301NP2) on board, and provides a PCI Express M.2 interface to user, which is 2230 Key-E M.2 interface. It is designed for ease of use and integration to the embedded systems.
This module has two variants described as follows:
BDE-BW3301NP1M2, single antenna port with U.FL connector;
BDE-BW3301NP2M2, dual antenna port with U.FL connector, supports antenna diversity.
Key Features
Highly optimized Wi-Fi 6 and Bluetooth Low Energy 5.2 system for low cost embedded IoT applications
Seamless integration with TI SitaraTM MPU (Linux) / MCU+ (FreeRTOS) as well as other application processors
3-wire or 1-wire PTA for external coexistence with additional 2.4GHz radios (e.g. Thread or Zigbee)
Multirole support e.g. STA and AP to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)
Optional antenna diversity or selection (BDE-BW3301NP2M2)
Operating temperature: -40°C to +85°C
Wi-Fi 6®
MAC, Baseband and RF Transceiver with support for IEEE 802.11 a/b/g/n/ax Wi-Fi6
Medium access controller (MAC)
Hardware-based encryption and decryption using supporting WPA2 and WPA3
TWT and OFDMA for optimal embedded performance
Application throughput up to 50 Mbps
Supports 4-bit SDIO and SPI host interfaces
Bluetooth® Low Energy 5.2
Bluetooth 5.2 supporting long-range and highspeed PHYs (up to 2 Mbps)
Host controller interface (HCI) transport for Bluetooth with option for shared SDIO or UART
Bluetooth Low Energy certified stack
Integrated 2.4G-Hz PA for complete wireless solution with up to +20dBm output power
Security
Secured host interface
Firmware authentication
Anti-rollback protection
Power Management
VDD_1V8: 1.62 V - 1.98 V
VDD_3V3: 2.1 V - 4.2 V
Clock Source:
On board 40 MHz XTAL fast clock
External 32.768-kHz slow clock by default
Interface and Form Factor
PCI Express M.2 standard – 2230 Key-E
22 mm x 30 mm x 2.8 mm
Regulatory (In Progress)
FCC
IC
CE-RED
Bluetooth SIG
Applications
Grid Infrastructure
Electricity Meter
String Inverter
Micro Inverter
Energy Storage Power Conversion System (PCS)
Building and Home Automation
HVAC Controller
HVAC Gateway
Thermostat
Building Security Gateway
Garage door system
IP network camera/ Video doorbell
Wireless security camera
Appliances
Refrigerator & freezer
Oven
Washer & dryer
Residential water heater & heating system
Air purifier & humidifier
Coffee machine
Air conditioner indoor unit
Vacuum robot
Robotic lawn mower
Medical
Infusion pump
Electronic hospital bed & bed control
Multiparameter patient monitor
Blood glucose monitor
Blood pressure monitor
CPAP machine
Telehealth systems
MRI
Ultrasound scanner
Ultrasound smart probe
Electric toothbrush
Retail Automation and Payment
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