BDE-LE2340R22KP is a Bluetooth® 5.3 Low Energy and Proprietary 2.4-GHz wireless module series based on Texas Instrument (TI)’s single-chip wireless microcontroller (MCU) CC2340R22E0RKPR. In order to fulfil different integration scenarios, we provide different variants for this module series.

BDE-LE2340R22KP module series integrates an Arm® Cortex®-M0+ MCU, which supports Bluetooth® 5.3 Low Energy, ZigBee®, SimpleLink™ TI 15.4-stack and Proprietary systems. This device is optimized for low-power wireless communication with on-chip dual image Over the Air Download (OAD) support in building automation (wireless sensors, lighting control, beacons), asset tracking, medical, retail EPOS (electronic point of sale), ESL (electronic shelf label), and personal electronics (toys, HID, stylus pens) markets.

BDE-LE2340R22KP module series can support up to +8 dBm output power and a receive sensitivity of -102 dBm for 125 kbps Bluetooth® Low Energy Coded PHY. It is with ultra-low standby current less than 0.71 μA with RTC operational and full RAM retention that enables significant battery life extension especially for applications with longer sleep intervals. The module series supports for Bluetooth® 5 features: High Speed Mode (2 Mbps PHY), Long Range (LE Coded 125 kbps and 500 kbps PHYs), Privacy 1.2.1 and Channel Selection Algorithm #2, as well as backwards compatibility and support for key features from the Bluetooth® 4.2 and earlier Low Energy specifications.

BDE-LE2340R22KP module series highly integrates the radio with required passives, high-frequency clock, low-frequency clock, filter, antenna, ect., and also a fully-qualified Bluetooth® 5.3 software protocol stack and profiles from TI. It can work standalone without using an external MCU. With its best-in-class radio performance, ultra-low power, small form factor and low cost, the BDE-LE2340R22KP module series is the best choice for the applications that are sensitive to power consumption, size and cost.

Key Features

Wireless microcontroller
 Optimized 48-MHz Arm® Cortex®-M0+
processor
 256 KB of in-system programmable flash
 12 KB of ROM for bootloader and drivers
 36 KB of ultra-low leakage SRAM. Full RAM
retention in standby mode
 Integrated 32-Mbit SPI flash
 BDE-LE2340R22KPA32
 BDE-LE2340R22KPU32
 BDE-LE2340R22KPN32
 BDE-LE2340R22KPA32-IN
 BDE-LE2340R22KPU32-IN
 BDE-LE2340R22KPN32-IN
 2.4-GHz RF transceiver compatible with
Bluetooth®5.3 Low Energy and IEEE 802.15.4
PHY and MAC
 Supports over-the-air upgrade (OTA)
 Serial Wire Debug (SWD)
 Low power consumption
 MCU consumption:
 2.6 mA active mode, CoreMark®
 53 μA/MHz running CoreMark®
 <710 nA standby mode, RTC, 36 KB RAM
 165 nA shutdown mode, wake-up on pin
 Radio Consumption:
 5.3 mA RX
 5.1 mA TX at +0 dBm
 <11.0 mA TX at +8 dBm
 Wireless protocol support
 Bluetooth® 5.3 Low Energy
 Zigbee®
 Thread
 Proprietary systems
 High performance radio
 -102 dBm for Bluetooth® Low Energy 125 kbps
 -96.5 dBm for Bluetooth® Low Energy 1 Mbps
 Output power up to +8 dBm with temperature
compensation
 Qualification and Regulatory Compliance
 Bluetooth SIG
 FCC
 IC
 CE-RED
 MCU peripherals
 Up to 26 I/O Pads
 2 IO pads SWD, muxed with GPIOs
 2 IO pads LFXT, muxed with GPIOs (Onboard LFXT is populated by default, these
two IOs are not exposed by default)
 Up to 22 DIOs (analog or digital IOs)
 Four IOs are assigned to on-board SPI
flash in SPI variants, refer to Section 2.1
 3x 16-bit or 1x 24-bit general-purpose timers,
quadrature decode mode support
 12-bit ADC, 1.2 Msps with external reference,
267 ksps with internal reference, up to 12
external ADC inputs
 1x low power comparator
 1x UART
 1x SPI
 1x I2C
 Real-time clock (RTC)
 Integrated temperature and battery monitor
 Watchdog timer
 Security enablers
 AES 128-bit cryptographic accelerator
 Random number generator from on-chip
analog noise
 Operating range
 1.71-V to 3.8-V single supply voltage
 2.3-V to 3.6-V single supply voltage (SPI flash
variants)
 Operating temperature range:
 -40℃ to +85℃
 -40℃ to +105℃ (-I variants)

 RoHS-compliant package
 Antenna
 BDE-LE2340R22KPA32/BDE-LE2340R22KPA0:Integrated PCB antenna
 BDE-LE2340R22KPU32/BDE-LE2340R22KPU0:Integrated U.FL connector for connecting
external antenna
 BDE-LE2340R22KPN32/BDE-LE2340R22KPN0: No antenna/connector included, ANT pin out for connecting external antenna
 Additional integrated components
 48-MHz HFXT

Package
 Dimension:
 11.5 mm x 13.5 mm x 2.0 mm (-A, -U
variants)
 11.5 mm x 9.70 mm x 2.0 mm (-N
variants)

 32.768-kHz LFXT
 32-Mbit SPI flash – SPI flash variants
 RF filter and passive components
 Development Option
 Functions as a SoC using TI SDK
 Functions as a UART pass-through using BDE’s
pre-programmed BDE-SPP firmware with AT
comments
 Functions as a Wireless Network Process
(WNP)

Applications

Medical
 Home healthcare – blood glucose monitors,blood pressure monitor, CPAP machine,electronic thermometer
 Patient monitoring & diagnostics – medical sensor patches
 Personal care & Fitness – electric toothbrush,wearable fitness & activity monitor
Building automation
 Building security systems – motion detector,electronic smart lock, door and window sensor, garage door system, gateway
 HVAC – thermostat, wireless environmental sensor
 Fire safety system – smoke and heat detector
 Video surveillance – IP network camera
Lighting
 LED luminaire
 Lighting control – daylight sensor, lighting sensor, wireless control
Factory automation and control
Retail automation & payment – Electronic point ofsale
 Electronic shelf label
Communication equipment
 Wired networking
 Wireless LAN or Wi-Fi access points, edgerouter
Personal electronics
 Connected peripherals – consumer wirelessmodule, pointing devices, keyboards and keypads 

  Gaming – electronic and robotic toys

 Wearables (non-medical) – smart trackers,smart clothing

Download:

BDE-LE2340R2KP_Datasheet_V0.4.pdf