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双模蓝牙 - BDE-BDM209A
  • BDE-BDM209A
  • 浏览 3642 次　发布日期：[ 2021-5-19 ]

  • 碧德（BDE）是美国德州仪器（TI）第三方合作伙伴


    BDE-BDM209A


    BDE-BDM209A是蓝牙5.1 BR/EDR和BLE双模式模块。该模块提供了一个独特的蓝牙经典和蓝牙低能耗无线电TI的CC2564C和一个ARM 32位Cortex-M4F CPU MSP432，集成了包括天线在内的所有外部组件，成本非常低廉。该模块提供了同类中最好的射频性能，发射功率和接收灵敏度提供了两倍的范围和更高的吞吐量，比其他低功耗蓝牙解决方案。在所有常用的蓝牙BR/EDR和低能耗运行模式中，电源管理硬件和软件算法提供了显著的功耗节省。认证和免版税的双模式蓝牙4.2协议栈软件提供了完整的蓝牙BR/EDR和蓝牙低能耗样品应用程序，减少了设计工作，并确保更快的上市时间。


    Key Features


    -Processing and memories
    - Arm® 32-bit Cortex®-M4F CPU with floating point unit and memory protection unit
    - Frequency up to 48 MHz
    - 256KB flash main memory (organized into two banks enabling simultaneous read or execute during erase)
    - 16KB of flash information memory
    - 64KB of SRAM (including 6KB of backup memory)
    - 32KB of ROM with MSP432™ peripheral driver libraries
    - Bluetooth 5.1 Declaration ID D049226
    - BR and EDR Features Include:
    - Up to Seven Active Devices
    - Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    - Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    - Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, μ-Law, and Transparent (Uncoded)
    - Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    - Support of Multiple Bluetooth Profiles with Enhanced QoS
    - Bluetooth Low Energy Features Include:
    - Support of up to 10 Simultaneous Connections
    - Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    - Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    - Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    - Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    - Class 1.5 TX Power up to +10 dBm
    - –93 dBm Typical RX Sensitivity
    - Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    - Improved Adaptive Frequency Hopping (AFH) Algorithm with Minimum Adaptation Time
    - Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
    - Advanced Power Management for Extended Battery Life and Ease of Design
    - Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    - Shutdown and Sleep Modes to Minimize Power Consumption
    - MCU Ultra-low-power operating modes when Bluetooth is Shutdown
    - Active: 80 μA/MHz
    - Low-frequency active: 83 μA at 128 kHz
    - LPM3 (with RTC): 660 nA
    - LPM3.5 (with RTC): 630 nA
    - LPM4: 500 nA
    - LPM4.5: 25 nA
    - Operating characteristics
    - Wide supply voltage range: 2.05V to 3.7V
    - Temperature range: –40°C to 85°C
    - Flexible clocking features
    - Tunable internal DCO (up to 48 MHz)
    - 32.768-kHz low-frequency crystal support (LFXT)
    - High-frequency crystal support (HFXT) up to 48 MHz
    - Low-frequency internal reference oscillator (REFO)
    - Very low-power low-frequency internal oscillator (VLO)
    - Module oscillator (MODOSC)
    - System oscillator (SYSOSC)
    - Code security features
    - JTAG and SWD lock
    - IP protection (up to four secure flash zones, each with configurable start address and size)
    - Enhanced system features
    - Programmable supervision and monitoring of supply voltage
    - Multiple-class resets for better control of application and debug
    - RTC with calendar and alarm functions
    - Timing and control
    - Up to four 16-bit timers, each with up to five capture, compare, PWM capability
    - Two 32-bit timers, each with interrupt generation capability
    - Physical Interfaces:
    - UART with automatic baud-rate detection
    - I2C (with multiple-slave addressing)
    - SPI (up to 16 Mbps)
    - Up to 17 GPIOs for users
    - All GPIOs with capacitive-touch capability
    - Ultra-low-leakage I/Os (±20 nA maximum)
    - Up to 15 I/Os with interrupt and wake-up capability
    - Two I/Os with glitch filtering capability
    - Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
    - Antenna: Chip antenna or U.FL connector
    - Encryption and data integrity accelerators
    - 128-, 192-, or 256-bit AES encryption and decryption accelerator
    - 32-bit hardware CRC engine
    - Bluetooth 4.2 Dual-mode stack
    - dual-mode Bluetooth 4.2 certified and royalty free
    - Fully qualified Bluetooth stack (QDID 85355 and QDID 69886)
    - Classic Bluetooth Profiles Available
    - A2DP1.2, AVDTP1.2, AVRCP1.3, HSP1.2, GAP, HID1.0, MAP1.0, PBAP1.0, RFCOMM, SDP, SPP. 
    - Bluetooth low energy Profiles Available
    - ANS1.0, BAS1.0, CSCS1.0, DIS1.0, FMP1.0, GAPS1.0, GATT1.0, HTS1.0, HRS1.0, HIDS1.0, IAS1.0, LLS1.0, PASS1.0, PXP1.0,  TPS1.0.
    - MFi Support
    - iAP Protocol (iAP 1/iAP 2) provided as an add-on upon request
    - Packaging
    - 12 mm x 22 mm x 2.1 mm package
    - Large variety of Sample Applications
    - Classic Bluetooth Sample Applications include: A3DP Sink/Source, HFP, HID, HSP, MAP, PBAP, SPP application demos.
    - BLE Sample Applications include: ANP, iBeacon, HRP, HTP, PASP, HOGP, PXP, FMP, CSCP application demos.
    - Classic Bluetooth + Bluetooth low energy Sample Applications include: SPP+SPPLE, SPP DMMulti application demos.
    - Development Environment supports:
    - CCS, Keil®, and IAR Embedded Workbench® IDEs.
    - Standards Conformance
    - Bluetooth- DID: D054396, QDID: 165249
    - FCC ID: 2ABRUBDM209A
    - IC: 25657-BDM209A
    - CE-RED
    - Japan
    - Korea
    - Taiwan
    - Australia
    - New Zealand
    - China


    应用：

    - 医疗设备

    - 运动和健身器材

    - 家用电子产品

    - 手机和电脑配件

    - 工业自动化


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