The BDE-WF3230 module, is a 802.11b/g/n, IPv4 & IPv6 Low Energy module based on CC3230S/F SoC.

The module offers a unique combination of lower power, integration of all external components including chip antenna at a very affordable cost.

Created for IoT , the BDE-WF3230 module is a wireless module that integrates two physically separated on-chip MCUs, application processor and network processor.

The BDE-WF3230 module is supported by easy to work with software to lower the threshold of using Wi-Fi technology or speeding up design time significantly.

The combination of affordable cost, lowest power and ease of use makes it an ideal product for the mass market, including the makers community.

Key Features

- Fully integrated and green and RoHS modules include all required clocks, SPI flash, and passives

- 802.11b/g/n: 2.4 GHz

- FIPS 140-2 Level 1 validated IC inside

- Multilayered security features help developers protect identities, data, and software IP

- Low-power modes for battery-powered applications

- Coexistence with 2.4-GHz radios

- Industrial temperature: –40°C to +85°C

- WF3230 module includes a chip antenna for easy integration into the host system

- 1.27-mm pitch QFM package for easy assembly and low-cost PCB design

- Transferrable Wi-Fi Alliance® certification

- Application microcontroller subsystem:

- Arm® Cortex®-M4 core at 80 MHz

- User-dedicated memory:

- 256KB of RAM

- Optional 1MB of executable flash

- Rich set of peripherals and timers:

- McASP supports two I2S channels

- SD, SPI, I2C, UART, ADC

- 8-bit parallel interface

- Timers and PWM

- Watchdog timer

- Up to 21 GPIO pins

- Debug interfaces: JTAG, cJTAG, SWD

- Wi-Fi network processor subsystem:

- Wi-Fi® core:

- 802.11 b/g/n

- Modes:

- Access point (AP)

- Station (STA)

- Wi-Fi Direct®

- Security:

- WEP

- WPA™/ WPA2™ PSK

- WPA2 Enterprise

- WPA3™ Personal

- Internet and application protocols:

- HTTPs server, mDNS, DNS-SD, DHCP

- IPv4 and IPv6 TCP/IP stack

- 16 BSD sockets (fully secured TLS v1.2 and SSL 3.0)

- Built-in power management subsystem:

- Configurable low-power profiles (always on, intermittently connected, tag)

- Advanced low-power modes

- Integrated DC/DC regulators

- Multilayered security features:

- Separate execution environments

- Networking security

- Device identity and key

- Hardware accelerator cryptographic engines(AES, DES, SHA/MD5, CRC)

- File system security (encryption, authentication, access control)

- Initial secure programming

- Software tamper detection

- Secure boot

- Certificate signing request (CSR)

- Unique per device key pair

- Application throughput

- UDP: 16 Mbps, TCP: 13 Mbps

- Peak: 72Mbps

- Power-Management Subsystem:

- Integrated DC/DC converters support a wide range of supply voltage:

- Single wide-voltage supply

- VBAT: 2.3 V to 3.6 V

- Advanced low-power modes:

- Shutdown: 1 μA, Hibernate: 4.5 μA

- Low-power deep sleep (LPDS):

- 120 μA

- Idle connected (MCU in LPDS):

- 710 μA

- RX traffic (MCU active): 59 mA

- TX traffic (MCU active): 223 mA

- Wi-Fi TX power

- 18 dBm at 1 DSSS

- 14.5dBm at 54OFDM

- Wi-Fi RX sensitivity

–96 dBm at 1 DSSS

-74.5 dBm at 54OFDM

- Additional integrated components

- 40.0-MHz crystal

- 32.768-kHz crystal (RTC)

- 32Mbit SPI serial flash(see Device Family)

- RF filters, diplexer and passive components

- Footprint-compatible QFM package

- 1.27-mm pitch, 63-pin, 17.5mm × 20.5mm × 2.4mm

- Module supports the TI SimpleLink Developer's Ecosystem

Applications

For Internet of Things applications, such as:

         Medical and Healthcare

      Multiparameter Patient Monitor

      Electrocardiogram (ECG)

      Electronic Hospital Bed & Bed Control

      Telehealth Systems

         Building and Home Automation:

      HVAC Systems & Thermostat

      Video Surveillance, Video Doorbells, and Low-Power Camera

      Building Security Systems and E-locks

         Appliances

         Asset Tracking

         Factory Automation

         Grid Infrastructure

         Device Family

Download

WF3230SN_Datasheet_EN_V2.1.pdf

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