BDE-MB1352P7 is a multiprotocol and multi-band Sub-1GHz and 2.4-GHz wireless module series consisting of CC1352P74T0RGZ single-chip wireless microcontroller (MCU). This series provides twelve options, customer can choose the suitable version for different application scenario.

 BDE-MB1352P71UA32 (PA on Sub-1GHz band, U.FL connector for Sub-1GHz, PCB Antenna for 2.4-GHz)

 BDE-MB1352P71UU32 (PA on Sub-1GHz band, U.FL connector for Sub-1GHz, U.FL Connector for 2.4-GHz)

 BDE-MB1352P71UN32 (PA on Sub-1GHz band, U.FL connector for Sub-1GHz, RF Pad Out for 2.4-GHz)

 BDE-MB1352P71NA32 (PA on Sub-1GHz band, RF Pad Out for Sub-1GHz, PCB Antenna for 2.4-GHz)

 BDE-MB1352P71NU32 (PA on Sub-1GHz band, RF Pad Out for Sub-1GHz, U.FL Connector for 2.4-GHz)

 BDE-MB1352P71NN32 (PA on Sub-1GHz band, RF Pad Out for Sub-1GHz, RF Pad Out for 2.4-GHz)

 BDE-MB1352P72UA32 (PA on 2.4-GHz band, U.FL connector for Sub-1GHz, PCB Antenna for 2.4-GHz)

 BDE-MB1352P72UU32 (PA on 2.4-GHz band, U.FL connector for Sub-1GHz, U.FL Connector for 2.4-GHz)

 BDE-MB1352P72UN32 (PA on 2.4-GHz band, U.FL connector for Sub-1GHz, RF Pad Out for 2.4-GHz)

 BDE-MB1352P72NA32 (PA on 2.4-GHz band, RF Pad Out for Sub-1GHz, PCB Antenna for 2.4-GHz)

 BDE-MB1352P72NU32 (PA on 2.4-GHz band, RF Pad Out for Sub-1GHz, U.FL Connector for 2.4-GHz)

 BDE-MB1352P71NN32 (PA on 2.4-GHz band, RF Pad Out for Sub-1GHz, RF Pad Out for 2.4-GHz)

Created for the IoT, the BDE-MB1352P7 integrates an Arm® Cortex®-M4F MCU, which supports Thread, Zigbee®, Bluetooth® 5.0 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty®, WI-SUN®, proprietary systems, TI 15.4-Stack (Sub-1 GHz and 2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. It optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The BDE-MB1352P7 supports operation in 861 to 1054-MHz, and 2360 to 2500-MHz frequency bands. PHY and frequency band switching can be done runtime through a dynamic multiprotocol manager (DMM) driver. It also has an efficient built-in PA that supports +20 dBm TX in the Sub-1 GHz band (BDE-MB1352P71 series) or in 2.4-GHz band. (BDE-MB1352P72 series)

The BDE-MB1352P7 has a low sleep current of 0.9 μA with RTC and 144KB RAM retention. In addition to the main Cortex® M4F processor, the device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1-μA system current. And it has Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime. Always-on RAM parity minimizes risk for corruption due to potential radiation events. Consistent with many customers’ 10 to 15 years or longer life cycle requirements.

The BDE-MB1352P7 highly integrates radio, stack, profile and applications in a SoC, without the need of using an external MCU. The module also offers flexible hardware interfaces for the sensor application. It enables ultra-low power connectivity and data transfer for the applications that are sensitive to power consumption, size and cost.

 

 Multiprotocol 2.4-GHz module consisting of CC1352P74T0RGZ single-chip wireless microcontroller (MCU)

 Wireless microcontroller

 Powerful 48-MHz Arm® Cortex®-M4F processor

 704KB flash program memory

 256KB of ROM for protocols and library functions

 8KB of cache SRAM

 144KB of ultra-low leakage SRAM with parity for high-reliability operation

 Dual-band Sub-1 GHz and 2.4 GHz operation

 Dynamic multiprotocol manager (DMM) driver

 Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, OOK, Bluetooth®5.0 Low Energy, IEEE 802.15.4 PHY and MAC

 Supports over-the-air upgrade(OTA)

 Ultra-low power sensor controller

 Autonomous MCU with 4KB of SRAM

 Sample, store, and process sensor data

 Fast wake-up for low-power operation

 Software defined peripherals; capacitive touch, flow meter, LCD

 Low power consumption

 MCU consumption:

 2.63 mA active mode, CoreMark

 55 μA/MHz running CoreMark

 0.8 μA standby mode, RTC, 144KB RAM

 0.1 μA shutdown mode, wake-up on pin

 Ultra low-power sensor controller consumption:

 25.2 μA in 2 MHz mode

 701 μA in 24 MHz mode

 Radio Consumption:

 5.4 mA RX at 868 MHz

 6.4 mA RX at 2.4 GHz

 24.9 mA TX at +14 dBm at 868 MHz

 64 mA TX at +20 dBm at 915 MHz

 Wireless protocol support

 Thread, Zigbee®, Matter

 Bluetooth®5.0 Low Energy

 WI-SUN®

 mioty®

 Amazon Sidewalk

 Wireless M-Bus

 SimpleLink™ TI 15.4-stack

 6LoWPAN

 Proprietary systems

 High performance radio

 -121 dBm for 2.5-kbps long-range mode

 -110 dBm at 50 kbps, 802.15.4, 868 MHz

 -103 dBm for Bluetooth® Low Energy 125-kbps

 Output power up to +20 dBm with temperature compensation

 Regulatory compliance (On-going)

 FCC

 IC

 CE-RED

 Bluetooth SIG

 MCU peripherals

 Digital peripherals can be routed to any GPIO

 Four 32-bit or eight 16-bit general-purpose timers

 12-bit ADC, 200 kSamples/s, 8 channels

 8-bit DAC

 Two comparators

 Programmable current source

 Two UART, two SSI, I2C, I2S

 Real-time clock (RTC)

 Integrated temperature and battery monitor

 Security enablers

 AES 128- and 256-bit cryptographic accelerator

 ECC and RSA public key hardware accelerator

 SHA2 Accelerator (full suite up to SHA-512)

 True random number generator (TRNG)

 Operating range

 On-chip buck DC/DC converter

 1.8-V to 3.8-V single supply voltage

 -40 to +85℃

 Package

 Dimension: 29.86 mm x 19.98 mm x 2.15 mm (With Shielding)

 QFM-42 (26 GPIOs)

 RoHS-compliant package

 Antenna:

 U.FL connector and RF pad selectable for Sub-1GHz band

 PCB antenna, U.FL connector and RF pad selectable for 2.4-GHz band

 Additional integrated components:

 48.0-MHz crystal

 32.768-kHz crystal (RTC)

 RF filter and passive components

 

 

 Grid infrastructure

 Smart Meters – electricity meter, water meter, gas meter and heat cost allocator

 Grid communications – wireless communications

 EV charging infrastructure – AC charging (pile) station

 Other alternative energy – energy harvesting

 Building automation

 Building security systems – motion detector, door and window sensor, glass break detector, panic button, electronic smart lock and IP network camera

 HVAC systems – thermostat, environmental sensor and HVAC controller

 Fire safety – smoke and head detector, gas detector and fire alarm control panel

 Retail Automation

 Retail automation & payment applications -electronic shelf labels and portable POS terminal

 Personal Electronics

 RF remote controls

 Smart Speakers, Smart Displays and Set-top box

 Gaming and electronic and robotic toys

 Wearables (non-medical), smart trackers, smart clothing and smartwatch

 Wireless Modules

 Wireless third party modules including Bluetooth Low Energy, Thread, Zigbee, Matter, Wi-SUN®, Amazon Sidewalk, mioty® and multiprotocol

 Wireless communications modules

Datasheet: BDE-MB1352P7_Datasheet_V1.0.pdf