- BDE-BW3350xPx series(TI CC3350 2.4/5GHz Wi-Fi6, -40°C to 105°C）
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- General Description
BDE-BW3350xP1 is a 2.4-GHz & 5-GHz dual-band Wi-Fi 6 wireless module series based on TI’s CC3350. This module series is ideal for cost-sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the peak application throughput requirement is a maximum of 50 Mbps. The BDE-BW3350xP1 module series is an excellent choice for bringing the efficiency of Wi-Fi 6 to embedded device applications, featuring a small PCB footprint and a highly optimized bill of materials for lower costs. Additionally, the module is backward compatible with Wi-Fi 4 (802.11 b/g/n) and Wi-Fi 5 (802.11 ac).
Key Features
Highly optimized Wi-Fi 6 (802.11ax) system for low cost embedded IoT applications
Seamless integration with any processor or MCU hosts capable of running a TCP/IP stack
Integrated 2.4-GHz and 5-GHz PA for complete wireless solution with up to +20 dBm output power
Application throughput up to 50 Mbps
Wi-Fi 6
2.4 GHz and 5 GHz, 20 MHz, single spatial stream
MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax
Target wake time (TWT), OFDMA, MU-MIMO (Downlink), Basic Service Set Coloring, and trigger frame for improved efficiency
Hardware-based encryption and decryption supporting WPA2 and WPA3
Excellent interoperability
Support for 4 bit SDIO or SPI host interfaces
Enhanced security
Secured host interface
Firmware authentication
Anti-rollback protection
Multirole support (for example, concurrent STA and AP) to connect with Wi-Fi devices on different RF channels (Wi-Fi networks)
3-wire or 1-wire PTA for external coexistence with additional 2.4-GHz radios (for example, Thread or Zigbee)
Operating temperature: -40°C to +85°C or -40°C to +105°C
Power management
VDD_1V8: 1.62 V - 1.98 V
VDD_3V3: 3 V – 3.6 V
Clock source
On-board 40 MHz XTAL fast clock
Internal slow clock or external 32.768-kHz slow clock
Antenna options
ANT pin for external antenna
U.FL connector for external antenna
Integrated PCB trace antenna
Package
LGA-64, 13.3-mm x 13.4-mm x 2-mm
LGA-64, 13.3-mm x 18.4-mm x 2-mm
Pin to Pin compatible with TI’s WL1837MOD (-N variants)
Pin to Pin compatible with BDE’s BDE-BW2837 (-N variants)
Regulatory compliance
FCC ID: 2ABRU-BW335P1
IC: 25657-BW335P1
TELEC: 219-248331
CE-RED
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