- BDE-LE2340R52GE(Bluetooth 5.3 Based on CC2340R52,with 12GPIOs)
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- General Description
BDE-LE2340RGE is a Bluetooth® 5.3 Low Energy, Zigbee, Thread, and Proprietary 2.4-GHz wireless module series based on Texas Instruments (TI)’s single-chip wireless microcontroller (MCU) CC2340R. In order to fulfil different integration scenarios, we provide different variants for this module series. They are listed and described in Table 1.
BDE-LE2340RGE module series integrates an Arm® Cortex®-M0+ MCU, which supports Bluetooth® 5.3 Low Energy, ZigBee®, SimpleLink™ TI 15.4-stack and Proprietary systems. This device is optimized for low-power wireless communication with on-chip dual image Over the Air Download (OAD) support in building automation (wireless sensors, lighting control, beacons), asset tracking, medical, retail EPOS (electronic point of sale), ESL (electronic shelf label), and personal electronics (toys, HID, stylus pens) markets.
BDE-LE2340RGE module series is with ultra-low standby current less than 0.71 μA with RTC operational and full RAM retention that enables significant battery life extension especially for applications with longer sleep intervals. The module series supports for Bluetooth® 5 features: High Speed Mode (2 Mbps PHY), Long Range (LE Coded 125 kbps and 500 kbps PHYs), Privacy 1.2.1 and Channel Selection Algorithm #2, as well as backwards compatibility and support for key features from the Bluetooth® 4.2 and earlier Low Energy specifications.
BDE-LE2340RGE module series highly integrates the radio with required passives, high-frequency clock, low-frequency clock, filter, antenna, etc., and also a fully-qualified Bluetooth® 5.3 software protocol stack and profiles from TI. It can work standalone without using an external MCU. With its best-in-class radio performance, ultra-low power, small form factor and low cost, the BDE-LE2340RGE module series is the best choice for the applications that are sensitive to power consumption, size and cost.
Key Features
Wireless microcontroller
Optimized 48-MHz Arm® Cortex®-M0+ processor
512 KB of in-system programmable flash
12 KB of ROM for bootloader and drivers
36 KB of ultra-low leakage SRAM. Full RAM retention in standby mode
2.4-GHz RF transceiver compatible with Bluetooth®5.3 Low Energy and IEEE 802.15.4 PHY and MAC
Supports over-the-air upgrade (OTA)
Serial Wire Debug (SWD)
Low power consumption
MCU consumption:
2.6 mA active mode, CoreMark®
53 μA/MHz running CoreMark®
<710 nA standby mode, RTC, 36 KB RAM
165 nA shutdown mode, wake-up on pin
Radio Consumption:
5.3 mA RX
5.1 mA TX at +0 dBm
<11.0 mA TX at +8 dBm
Wireless protocol support
Bluetooth® 5.3 Low Energy
Zigbee®
Thread
Proprietary systems
High performance radio
-101 dBm for Bluetooth® Low Energy 125 kbps
-94.5 dBm for Bluetooth® Low Energy 1 Mbps
Output power up to +8 dBm with temperature compensation
MCU peripherals
Up to 10 I/O Pads
2 IO pads SWD, muxed with GPIOs
2 IO pads LFXT, muxed with GPIOs (On-board LFXT is populated by default, these two IOs are not exposed by default. They can be reserved for users if on-board LFXT is not required. Contact BDE if you need to use these two IOs)
Up to 8 DIOs (analog or digital IOs)
Four IOs are assigned to on-board SPI flash in SPI variants, refer to Section 2.1
3x 16-bit or 1x 24-bit general-purpose timers, quadrature decode mode support
12-bit ADC, 1.2 Msps with external reference, 267 ksps with internal reference, up to 12 external ADC inputs
1x low power comparator
1x UART
1x SPI
1x I2C
Real-time clock (RTC)
Integrated temperature and battery monitor
Watchdog timer
Security enablers
AES 128-bit cryptographic accelerator
Random number generator from on-chip analog noise
Integrated 32-Mbit SPI flash (SPI flash variants)
Additional integrated components
48-MHz HFXT
32.768-kHz LFXT
32-Mbit SPI flash – SPI flash variants
RF filter and passive components
Antenna options
Integrated PCB antenna
U.FL connector for external antenna
ANT pin for external antenna
Operating range
1.71-V to 3.8-V single supply voltage
2.3-V to 3.6-V single supply voltage (SPI flash variants)
Operating temperature range:
-40℃ to +85℃
-40℃ to +105℃ (-IN variants)
Package
Dimension:
11.5 mm x 13.5 mm x 2.0 mm (-A, -U variants)
11.5 mm x 9.70 mm x 2.0 mm (-N variants)
RoHS-compliant package
Development options
Functions as a SoC using TI SDK
Functions as a UART pass-through using BDE’s pre-programmed BDE-SPP firmware with AT comments
Functions as a Wireless Network Process (WNP)
Qualification and regulatory compliance
Bluetooth SIG, DN: Q332693
FCC ID: 2ABRU-LE2340RGE
IC: 25657-LE2340RGE
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