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Bluetooth Low Energy - BDE-LE2340R52GE(Bluetooth 5.3 Based on CC2340R52,with 12GPIOs)
  • BDE-LE2340R52GE(Bluetooth 5.3 Based on CC2340R52,with 12GPIOs)

  •  General Description

    BDE-LE2340RGE is a Bluetooth® 5.3 Low Energy, Zigbee, Thread, and Proprietary 2.4-GHz wireless module series based on Texas Instruments (TI)’s single-chip wireless microcontroller (MCU) CC2340R. In order to fulfil different integration scenarios, we provide different variants for this module series. They are listed and described in Table 1.

     

    BDE-LE2340RGE module series integrates an Arm® Cortex®-M0+ MCU, which supports Bluetooth® 5.3 Low Energy, ZigBee®, SimpleLink™ TI 15.4-stack and Proprietary systems. This device is optimized for low-power wireless communication with on-chip dual image Over the Air Download (OAD) support in building automation (wireless sensors, lighting control, beacons), asset tracking, medical, retail EPOS (electronic point of sale), ESL (electronic shelf label), and personal electronics (toys, HID, stylus pens) markets.

     

    BDE-LE2340RGE module series is with ultra-low standby current less than 0.71 μA with RTC operational and full RAM retention that enables significant battery life extension especially for applications with longer sleep intervals. The module series supports for Bluetooth® 5 features: High Speed Mode (2 Mbps PHY), Long Range (LE Coded 125 kbps and 500 kbps PHYs), Privacy 1.2.1 and Channel Selection Algorithm #2, as well as backwards compatibility and support for key features from the Bluetooth® 4.2 and earlier Low Energy specifications.

     

    BDE-LE2340RGE module series highly integrates the radio with required passives, high-frequency clock, low-frequency clock, filter, antenna, etc., and also a fully-qualified Bluetooth® 5.3 software protocol stack and profiles from TI. It can work standalone without using an external MCU. With its best-in-class radio performance, ultra-low power, small form factor and low cost, the BDE-LE2340RGE module series is the best choice for the applications that are sensitive to power consumption, size and cost.

    Orderable Part Number

    Chipset

    Flash (KB)

    SRAM (KB)

    Antenna Options

    On-board SPI Flash (Mbit)

    Operating Temperature ()

    BDE-LE2340R52GEA32

    CC2340R52N0RGER

    512

    36

    PCB antenna

    32

    -40 ~ 85

    BDE-LE2340R52GEU32

    U.FL connector

    BDE-LE2340R52GEN32

    ANT pin

    BDE-LE2340R52GEA0

    PCB antenna

    0

    BDE-LE2340R52GEU0

    U.FL connector

    BDE-LE2340R52GEN0

    ANT pin

    BDE-LE2340R52GEA32-IN

    CC2340R52E0RGER

    PCB antenna

    32

    -40 ~ 105

    BDE-LE2340R52GEU32-IN

    U.FL connector

    BDE-LE2340R52GEN32-IN

    ANT pin

    BDE-LE2340R52GEA0-IN

    PCB antenna

    0

    BDE-LE2340R52GEU0-IN

    U.FL connector

    BDE-LE2340R52GEN0-IN

    ANT pin

    BDE-LE2340R21GEA32

    CC2340R21N0RGER

    256

    28

    PCB antenna

    32

    -40 ~ 85

    BDE-LE2340R21GEU32

    U.FL connector

    BDE-LE2340R21GEN32

    ANT pin

    BDE-LE2340R21GEA0

    PCB antenna

    0

    BDE-LE2340R21GEU0

    U.FL connector

    BDE-LE2340R21GEN0

    ANT pin

    BDE-LE2340R21GEA32-IN

    CC2340R21E0RGER

    PCB antenna

    32

    -40 ~ 105

    BDE-LE2340R21GEU32-IN

    U.FL connector

    BDE-LE2340R21GEN32-IN

    ANT pin

    BDE-LE2340R21GEA0-IN

    PCB antenna

    0

    BDE-LE2340R21GEU0-IN

    U.FL connector

    BDE-LE2340R21GEN0-IN

    ANT pin

    Key Features

        Wireless microcontroller

        Optimized 48-MHz Arm® Cortex®-M0+ processor

        512/256 KB of in-system programmable flash

        12 KB of ROM for bootloader and drivers

        36/28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode

        2.4-GHz RF transceiver compatible with Bluetooth®5.3 Low Energy and IEEE 802.15.4 PHY and MAC

        Supports over-the-air upgrade (OTA)

        Serial Wire Debug (SWD)

        Low power consumption

        MCU consumption:

        2.6 mA active mode, CoreMark®

        53 μA/MHz running CoreMark®

        <710 nA standby mode, RTC, 36 KB RAM

        165 nA shutdown mode, wake-up on pin

        Radio Consumption:

        5.3 mA RX

        5.1 mA TX at +0 dBm

        <11.0 mA TX at +8 dBm

        Wireless protocol support

        Bluetooth® 5.3 Low Energy

        Zigbee®

        Thread

        Proprietary systems

        High performance radio

        -101 dBm for Bluetooth® Low Energy 125 kbps

        -94.5 dBm for Bluetooth® Low Energy 1 Mbps

        Output power up to +8 dBm with temperature compensation

        MCU peripherals

        Up to 10 I/O Pads

        2 IO pads SWD, muxed with GPIOs

        2 IO pads LFXT, muxed with GPIOs (On-board LFXT is populated by default, these two IOs are not exposed by default. They can be reserved for users if on-board LFXT is not required. Contact BDE if you need to use these two IOs)

        Up to 8 DIOs (analog or digital IOs)

        Four IOs are assigned to on-board SPI flash in SPI variants, refer to Section 2.1

        3x 16-bit or 1x 24-bit general-purpose timers, quadrature decode mode support

        12-bit ADC, 1.2 Msps with external reference, 267 ksps with internal reference, up to 12 external ADC inputs

        1x low power comparator

        1x UART

        1x SPI

        1x I2C

        Real-time clock (RTC)

        Integrated temperature and battery monitor

        Watchdog timer

        Security enablers

        AES 128-bit cryptographic accelerator

        Random number generator from on-chip analog noise

        Integrated 32-Mbit SPI flash (SPI flash variants)

        Additional integrated components

        48-MHz HFXT

        32.768-kHz LFXT

        32-Mbit SPI flash – SPI flash variants

        RF filter and passive components

        Antenna options

        Integrated PCB antenna

        U.FL connector for external antenna

        ANT pin for external antenna

        Operating range

        1.71-V to 3.8-V single supply voltage

        2.3-V to 3.6-V single supply voltage (SPI flash variants)

        Operating temperature range:

        -40℃ to +85℃

        -40℃ to +105℃ (-IN variants)

        Package

        Dimension:

        11.5 mm x 13.5 mm x 2.0 mm (-A, -U variants)

        11.5 mm x 9.70 mm x 2.0 mm (-N variants)

        RoHS-compliant package

        Development options

        Functions as a SoC using TI SDK

        Functions as a UART pass-through using BDE’s pre-programmed BDE-SPP firmware with AT comments

        Functions as a Wireless Network Process (WNP)

        Qualification and regulatory compliance

        Bluetooth SIG, DN: Q332693

        FCC ID: 2ABRU-LE2340RGE

        IC: 25657-LE2340RGE

        CE-RED

     

    Applications

     

        Medical

        Home healthcare – blood glucose monitors, blood pressure monitor, CPAP machine, electronic thermometer

        Patient monitoring & diagnostics – medical sensor patches

        Personal care & Fitness – electric toothbrush, wearable fitness & activity monitor

        Building automation

        Building security systems – motion detector, electronic smart lock, door and window sensor, garage door system, gateway

        HVAC – thermostat, wireless environmental sensor

        Fire safety system – smoke and heat detector

        Video surveillance – IP network camera

        Lighting

        LED luminaire

        Lighting control – daylight sensor, lighting sensor, wireless control

        Factory automation and control

        Retail automation & payment – Electronic point of sale

        Electronic shelf label

        Communication equipment

        Wired networking

        Wireless LAN or Wi-Fi access points, edge router

        Personal electronics

        Connected peripherals – consumer wireless module, pointing devices, keyboards and keypads

        Gaming – electronic and robotic toys

        Wearables (non-medical) – smart trackers, smart clothing


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