BDE-LE2340RGE is a Bluetooth® 5.3 Low
Energy, Zigbee, Thread, and Proprietary 2.4-GHz wireless module series based on
Texas Instruments (TI)’s single-chip wireless microcontroller (MCU) CC2340R. In
order to fulfil different integration scenarios, we provide different variants
for this module series. They are listed and described in Table 1.
BDE-LE2340RGE module series integrates an
Arm® Cortex®-M0+ MCU, which supports Bluetooth® 5.3 Low Energy, ZigBee®,
SimpleLink™ TI 15.4-stack and Proprietary systems. This device is optimized for
low-power wireless communication with on-chip dual image Over the Air Download
(OAD) support in building automation (wireless sensors, lighting control,
beacons), asset tracking, medical, retail EPOS (electronic point of sale), ESL
(electronic shelf label), and personal electronics (toys, HID, stylus pens)
markets.
BDE-LE2340RGE module series is with
ultra-low standby current less than 0.71 μA with RTC operational and full RAM
retention that enables significant battery life extension especially for
applications with longer sleep intervals. The module series supports for
Bluetooth® 5 features: High Speed Mode (2 Mbps PHY), Long Range (LE Coded 125
kbps and 500 kbps PHYs), Privacy 1.2.1 and Channel Selection Algorithm #2, as
well as backwards compatibility and support for key features from the
Bluetooth® 4.2 and earlier Low Energy specifications.
BDE-LE2340RGE module series highly
integrates the radio with required passives, high-frequency clock,
low-frequency clock, filter, antenna, etc., and also a fully-qualified
Bluetooth® 5.3 software protocol stack and profiles from TI. It can work
standalone without using an external MCU. With its best-in-class radio
performance, ultra-low power, small form factor and low cost, the BDE-LE2340RGE
module series is the best choice for the applications that are sensitive to
power consumption, size and cost.
Orderable Part Number |
Chipset |
Flash (KB) |
SRAM (KB) |
Antenna Options |
On-board SPI Flash (Mbit) |
Operating Temperature (℃) |
BDE-LE2340R52GEA32 |
CC2340R52N0RGER |
512 |
36 |
PCB antenna |
32 |
-40 ~ 85 |
BDE-LE2340R52GEU32 |
U.FL connector |
|||||
BDE-LE2340R52GEN32 |
ANT pin |
|||||
BDE-LE2340R52GEA0 |
PCB antenna |
0 |
||||
BDE-LE2340R52GEU0 |
U.FL connector |
|||||
BDE-LE2340R52GEN0 |
ANT pin |
|||||
BDE-LE2340R52GEA32-IN |
CC2340R52E0RGER |
PCB antenna |
32 |
-40 ~ 105 |
||
BDE-LE2340R52GEU32-IN |
U.FL connector |
|||||
BDE-LE2340R52GEN32-IN |
ANT pin |
|||||
BDE-LE2340R52GEA0-IN |
PCB antenna |
0 |
||||
BDE-LE2340R52GEU0-IN |
U.FL connector |
|||||
BDE-LE2340R52GEN0-IN |
ANT pin |
|||||
BDE-LE2340R21GEA32 |
CC2340R21N0RGER |
256 |
28 |
PCB antenna |
32 |
-40 ~ 85 |
BDE-LE2340R21GEU32 |
U.FL connector |
|||||
BDE-LE2340R21GEN32 |
ANT pin |
|||||
BDE-LE2340R21GEA0 |
PCB antenna |
0 |
||||
BDE-LE2340R21GEU0 |
U.FL connector |
|||||
BDE-LE2340R21GEN0 |
ANT pin |
|||||
BDE-LE2340R21GEA32-IN |
CC2340R21E0RGER |
PCB antenna |
32 |
-40 ~ 105 |
||
BDE-LE2340R21GEU32-IN |
U.FL connector |
|||||
BDE-LE2340R21GEN32-IN |
ANT pin |
|||||
BDE-LE2340R21GEA0-IN |
PCB antenna |
0 |
||||
BDE-LE2340R21GEU0-IN |
U.FL connector |
|||||
BDE-LE2340R21GEN0-IN |
ANT pin |
Key Features
Wireless
microcontroller
Optimized
48-MHz Arm® Cortex®-M0+ processor
512/256
KB of in-system programmable flash
12
KB of ROM for bootloader and drivers
36/28
KB of ultra-low leakage SRAM. Full RAM retention in standby mode
2.4-GHz
RF transceiver compatible with Bluetooth®5.3 Low Energy and IEEE 802.15.4 PHY
and MAC
Supports
over-the-air upgrade (OTA)
Serial
Wire Debug (SWD)
Low
power consumption
MCU
consumption:
2.6
mA active mode, CoreMark®
53
μA/MHz running CoreMark®
<710
nA standby mode, RTC, 36 KB RAM
165
nA shutdown mode, wake-up on pin
Radio
Consumption:
5.3
mA RX
5.1
mA TX at +0 dBm
<11.0
mA TX at +8 dBm
Wireless
protocol support
Bluetooth®
5.3 Low Energy
Zigbee®
Thread
Proprietary
systems
High
performance radio
-101
dBm for Bluetooth® Low Energy 125 kbps
-94.5
dBm for Bluetooth® Low Energy 1 Mbps
Output
power up to +8 dBm with temperature compensation
MCU
peripherals
Up
to 10 I/O Pads
2
IO pads SWD, muxed with GPIOs
2
IO pads LFXT, muxed with GPIOs (On-board LFXT is populated by default, these
two IOs are not exposed by default. They can be reserved for users if on-board
LFXT is not required. Contact BDE if you need to use these two IOs)
Up
to 8 DIOs (analog or digital IOs)
Four
IOs are assigned to on-board SPI flash in SPI variants, refer to Section 2.1
3x
16-bit or 1x 24-bit general-purpose timers, quadrature decode mode support
12-bit
ADC, 1.2 Msps with external reference, 267 ksps with internal reference, up to
12 external ADC inputs
1x
low power comparator
1x
UART
1x
SPI
1x
I2C
Real-time
clock (RTC)
Integrated
temperature and battery monitor
Watchdog
timer
Security
enablers
AES
128-bit cryptographic accelerator
Random
number generator from on-chip analog noise
Integrated
32-Mbit SPI flash (SPI flash variants)
Additional
integrated components
48-MHz
HFXT
32.768-kHz
LFXT
32-Mbit
SPI flash – SPI flash variants
RF
filter and passive components
Antenna
options
Integrated
PCB antenna
U.FL
connector for external antenna
ANT
pin for external antenna
Operating
range
1.71-V
to 3.8-V single supply voltage
2.3-V
to 3.6-V single supply voltage (SPI flash variants)
Operating
temperature range:
-40℃
to +85℃
-40℃
to +105℃ (-IN variants)
Package
Dimension:
11.5
mm x 13.5 mm x 2.0 mm (-A, -U variants)
11.5
mm x 9.70 mm x 2.0 mm (-N variants)
RoHS-compliant
package
Development
options
Functions
as a SoC using TI SDK
Functions
as a UART pass-through using BDE’s pre-programmed BDE-SPP firmware with AT
comments
Functions
as a Wireless Network Process (WNP)
Qualification
and regulatory compliance
Bluetooth
SIG, DN: Q332693
FCC
ID: 2ABRU-LE2340RGE
IC:
25657-LE2340RGE
CE-RED
Applications
Medical
Home
healthcare – blood glucose monitors, blood pressure monitor, CPAP machine,
electronic thermometer
Patient
monitoring & diagnostics – medical sensor patches
Personal
care & Fitness – electric toothbrush, wearable fitness & activity
monitor
Building
automation
Building
security systems – motion detector, electronic smart lock, door and window
sensor, garage door system, gateway
HVAC
– thermostat, wireless environmental sensor
Fire
safety system – smoke and heat detector
Video
surveillance – IP network camera
Lighting
LED
luminaire
Lighting
control – daylight sensor, lighting sensor, wireless control
Factory
automation and control
Retail
automation & payment – Electronic point of sale
Electronic
shelf label
Communication
equipment
Wired
networking
Wireless
LAN or Wi-Fi access points, edge router
Personal
electronics
Connected
peripherals – consumer wireless module, pointing devices, keyboards and keypads
Gaming
– electronic and robotic toys
Wearables
(non-medical) – smart trackers, smart clothing