BDE-BDM209A is a Bluetooth 5.1 BR/EDR & Bluetooth 5.1 Low Energy Dual Mode module. The module offers a unique combination of
Bluetooth® classic and Bluetooth Low Energy radio TI’s CC2564C and an ARM 32-bit
Cortex-M4F CPU MSP432, with integration of all external components including
antenna at a very affordable cost.
The module provides the best-in-class RF
performance with transmit power and receive sensitivity that provides twice the
range and higher throughput than other Bluetooth-low-energy-only solutions. The
power-management hardware and software algorithms provide significant power
savings in all commonly used Bluetooth® BR/EDR and low energy modes of
operation.
The certified and royalty free Dual-mode
Bluetooth® 5.1 protocol stack software provides a complete Bluetooth® BR/EDR, and
Bluetooth Low Energy sample applications that reduce design effort and ensure a
faster time to market.
Key Features
-Processing and memories
- Arm® 32-bit Cortex®-M4F CPU with
floating point unit and memory protection unit
- Frequency up to 48 MHz
- 256KB flash main memory (organized
into two banks enabling simultaneous read or execute during erase)
- 16KB of flash information memory
- 64KB of SRAM (including 6KB of
backup memory)
- 32KB of ROM with MSP432™
peripheral driver libraries
- Bluetooth® 4.2 Declaration ID D049226
- BR and EDR Features Include:
- Up to Seven Active Devices
- Scatternet: Up to Three Piconets Simultaneously,
One as Master and Two as Slaves
- Up to Two Synchronous Connection
Oriented (SCO) Links on the Same Piconet
- Support for All Voice
Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, μ-Law, and
Transparent (Uncoded)
- Assisted Mode for HFP 1.6 Wideband
Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
- Support of Multiple Bluetooth® Profiles with Enhanced QoS
- Bluetooth Low Energy Features
Include:
- Support of up to 10 Simultaneous
Connections
- Multiple Sniff Instances Tightly
Coupled to Achieve Minimum Power Consumption
- Independent Buffering for Low
Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR
Performance
- Built-In Coexistence and
Prioritization Handling for BR, EDR, and Low Energy
- Best-in-Class Bluetooth® (RF)
Performance (TX Power, RX Sensitivity, Blocking)
- Class 1.5 TX Power up to +10 dBm
- –93 dBm Typical RX Sensitivity
- Internal Temperature Detection and
Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No
External Calibration Required
- Improved Adaptive Frequency
Hopping (AFH) Algorithm with Minimum Adaptation Time
- Provides Longer Range, Including
Twice the Range of Other Low-Energy-Only Solutions
- Advanced Power Management for
Extended Battery Life and Ease of Design
- Low Power Consumption for Active,
Standby, and Scan Bluetooth® Modes
- Shutdown and Sleep Modes to
Minimize Power Consumption
- MCU Ultra-low-power operating modes
when Bluetooth® is Shutdown
- Active: 80 μA/MHz
- Low-frequency active: 83 μA at 128
kHz
- LPM3 (with RTC): 660 nA
- LPM3.5 (with RTC): 630 nA
- LPM4: 500 nA
- LPM4.5: 25 nA
- Operating characteristics
- Wide supply voltage range: 2.05V
to 3.7V
- Temperature range: –40°C to 85°C
- Flexible clocking features
- Tunable internal DCO (up to 48
MHz)
- 32.768-kHz low-frequency crystal
support (LFXT)
- High-frequency crystal support (HFXT)
up to 48 MHz
- Low-frequency internal reference
oscillator (REFO)
- Very low-power low-frequency
internal oscillator (VLO)
- Module oscillator (MODOSC)
- System oscillator (SYSOSC)
- Code security features
- JTAG and SWD lock
- IP protection (up to four secure
flash zones, each with configurable start address and size)
- Enhanced system features
- Programmable supervision and
monitoring of supply voltage
- Multiple-class resets for better
control of application and debug
- RTC with calendar and alarm
functions
- Timing and control
- Up to four 16-bit timers, each
with up to five capture, compare, PWM capability
- Two 32-bit timers, each with
interrupt generation capability
- Physical Interfaces:
- UART with automatic baud-rate
detection
- I2C (with multiple-slave
addressing)
- SPI (up to 16 Mbps)
- Up to 17 GPIOs for users
- All GPIOs with capacitive-touch
capability
- Ultra-low-leakage I/Os (±20 nA
maximum)
- Up to 15 I/Os with interrupt and
wake-up capability
- Two I/Os with glitch filtering
capability
- Fully Programmable Digital
Pulse-Code Modulation (PCM)–I2S Codec Interface
- Antenna: Chip antenna or U.FL connector
- Encryption and data integrity accelerators
- 128-, 192-, or 256-bit AES
encryption and decryption accelerator
- 32-bit hardware CRC engine
- Bluetooth® 5.1 Dual-mode stack
- Dual-mode Bluetooth® 5.1 certified
and royalty free
- Classic Bluetooth® Profiles Available
- A2DP1.2, AVDTP1.2, AVRCP1.3,
HSP1.2, GAP, HID1.0, MAP1.0, PBAP1.0, RFCOMM, SDP, SPP.
- Bluetooth Low Energy Profiles
Available
- ANS1.0, BAS1.0, CSCS1.0, DIS1.0,
FMP1.0, GAPS1.0, GATT1.0, HTS1.0, HRS1.0, HIDS1.0, IAS1.0, LLS1.0, PASS1.0,
PXP1.0, TPS1.0.
- MFi Support
- iAP Protocol (iAP 1/iAP 2)
provided as an add-on upon request
- Packaging
- 12 mm x 22 mm x 2.1 mm package
- Large variety of Sample
Applications
- Classic Bluetooth® Sample
Applications include: A3DP Sink/Source, HFP, HID, HSP, MAP, PBAP, SPP application
demos.
- Bluetooth 5.1 Low Energy Sample Applications include:
ANP, iBeacon, HRP, HTP, PASP, HOGP, PXP, FMP, CSCP application demos.
- Classic Bluetooth® + Bluetooth Low Energy Sample Applications include: SPP+SPPLE, SPP DMMulti application demos.
- Development Environment supports:
- CCS, Keil®, and IAR Embedded
Workbench® IDEs.
- Standards Conformance
- Bluetooth®- DID: D054396,
QDID: 165249
- FCC ID: 2ABRUBDM209A
- IC: 25657-BDM209A
- CE-RED
- Japan
- Korea
- Taiwan
- Australia
- New Zealand
- China
Applications
- Medical devices
- Sports and fitness equipment
- Home electronics
- Mobile and PC accessories
- Industry automation
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