Processing and memories

        Arm® 32bit Cortex®M4F CPU with floating point unit and memory protection unit    

        Frequency up to 48 MHz

        256KB flash main memory (organized into two banks enabling simultaneous read or execute during erase)

        16KB of flash information memory

        64KB of SRAM (including 6KB of backup memory)

        32KB of ROM with MSP432™ peripheral driver libraries

 Bluetooth® 4.2 Declaration ID D049226

 BR and EDR Features Include:

        Up to Seven Active Devices

        Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves

        Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet

        Support for All Voice AirCoding—Continuously Variable Slope Delta (CVSD), ALaw, μLaw, and Transparent (Uncoded)

        Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power

        Support of Multiple Bluetooth® Profiles with Enhanced QoS

 Bluetooth Low Energy Features Include:

        Support of up to 10 Simultaneous Connections

        Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption

        Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance

        BuiltIn Coexistence and Prioritization Handling for BR, EDR, and Low Energy

 BestinClass Bluetooth® (RF) Performance (TX Power, RX Sensitivity, Blocking)

        Class 1.5 TX Power up to +10 dBm

        –93 dBm Typical RX Sensitivity

        Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required

        Improved Adaptive Frequency Hopping (AFH) Algorithm with Minimum Adaptation Time

        Provides Longer Range, Including Twice the Range of Other LowEnergyOnly Solutions

 Advanced Power Management for Extended Battery Life and Ease of Design

        Low Power Consumption for Active, Standby, and Scan Bluetooth® Modes

        Shutdown and Sleep Modes to Minimize Power Consumption

 MCU Ultralowpower operating modes when Bluetooth® is Shutdown

        Active: 80 μA/MHz

        Lowfrequency active: 83 μA at 128 kHz

        LPM3 (with RTC): 660 nA

        LPM3.5 (with RTC): 630 nA

        LPM4: 500 nA

        LPM4.5: 25 nA

 Operating characteristics

        Wide supply voltage range: 2.05V to 3.7V

        Temperature range: –40°C to 85°C

 Flexible clocking features

        Tunable internal DCO (up to 48 MHz)

                      32.768kHz lowfrequency crystal support (LFXT)

                      Highfrequency crystal support (HFXT) up to 48 MHz

                      Lowfrequency internal reference oscillator (REFO)

                      Very lowpower lowfrequency internal oscillator (VLO)

        Module oscillator (MODOSC)

        System oscillator (SYSOSC)

 Code security features

        JTAG and SWD lock

        IP protection (up to four secure flash zones, each with configurable start address and size)

 Enhanced system features

        Programmable supervision and monitoring of supply voltage

        Multipleclass resets for better control of application and debug

        RTC with calendar and alarm functions

 Timing and control

        Up to four 16bit timers, each with up to five capture, compare, PWM capability

        Two 32bit timers, each with interrupt generation capability

 Physical Interfaces:

        UART with automatic baudrate detection

        I2C (with multipleslave addressing)

        SPI (up to 16 Mbps)

        Up to 17 GPIOs for users

        All GPIOs with capacitivetouch capability

        Ultralowleakage I/Os (±20 nA maximum)

        Up to 15 I/Os with interrupt and wakeup capability

        Two I/Os with glitch filtering capability

        Fully Programmable Digital PulseCode Modulation (PCM)–I2S Codec Interface

 Antenna: Chip antenna or U.FL connector

 Encryption and data integrity accelerators

        128, 192, or 256bit AES encryption and decryption accelerator

        32bit hardware CRC engine

 Bluetooth® 5.1 Dualmode stack

        Dualmode Bluetooth® 5.1 certified and royalty free

 Classic Bluetooth® Profiles Available

        A2DP1.2, AVDTP1.2, AVRCP1.3, HSP1.2, GAP, HID1.0, MAP1.0, PBAP1.0, RFCOMM, SDP, SPP. 

 Bluetooth Low Energy Profiles Available

        ANS1.0, BAS1.0, CSCS1.0, DIS1.0, FMP1.0, GAPS1.0, GATT1.0, HTS1.0, HRS1.0, HIDS1.0, IAS1.0, LLS1.0, PASS1.0, PXP1.0, TPS1.0.

 MFi Support

        iAP Protocol (iAP 1/iAP 2) provided as an addon upon request

 Packaging

        12 mm x 22 mm x 2.1 mm package

 Large variety of Sample Applications

        Classic Bluetooth® Sample Applications include: A3DP Sink/Source, HFP, HID, HSP, MAP, PBAP, SPP application demos.

        Bluetooth 5.1 Low Energy Sample Applications include: ANP, iBeacon, HRP, HTP, PASP, HOGP, PXP, FMP, CSCP application demos.

        Classic Bluetooth® + Bluetooth Low Energy Sample Applications include: SPP+SPPLE, SPP DMMulti application demos.

 Development Environment supports:

        CCS, Keil®, and IAR Embedded Workbench® IDEs.

 Standards Conformance

        Bluetooth® DID: D054396, QDID: 165249

        FCC ID: 2ABRUBDM209A

        IC: 25657BDM209A

        CERED

        Japan

        Korea

        Taiwan

        Australia

        New Zealand

        China