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WiFi - BDE-WF3135N(WiFi Dual-Band Network Processor Module Based on CC3135)
  • BDE-WF3135N(WiFi Dual-Band Network Processor Module Based on CC3135)

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    General Description

    BDE-WF3135N dramatically simplifies the implementation of Internet connectivity. This dual-band Wi-Fi® network processor module can be added to any low-cost, low-power microcontroller unit (MCU); it integrates all protocols for Wi-Fi® and Internet, which greatly minimize host MCU software requirements.

    This ROM-based subsystem includes an 802.11 a/b/g/n dual-band 2.4 GHz and 5 GHz radio, baseband, and MAC with powerful hardware cryptographic engine. With built-in security protocols, the BDE-WF3135A solution provides a robust and simple security experience. The BDE-WF3135A is available in an LGA package that is easy to lay out with all required components including serial Flash, RF filters, diplexer, crystal, and passive components that are fully integrated.

    This generation introduces new capabilities that further simplify the connectivity of things to the Internet. The main new features of BDE-WF3135N include:

           802.11 a/b/g/n: 2.4 GHz and 5 GHz support

           2.4 GHz Coexistence with Bluetooth® low energy radio

           Antenna diversity

           More concurrent secure sockets, up to 16

           Unique device identifier with ability to generate certificate signing request (CSR)

           Online certificate status protocol (OCSP)

           Wi-Fi Alliance® certified for IoT low power capabilities

           Hostless mode for offloading template packet transmissions

           Improved fast scan. 

    Key Features


    Fully integrated and green/RoHS module includes all required clocks, serial peripheral interface (SPI) flash, and passives

    Integrated Wi-Fi® and internet protocols 

    802.11a/b/g/n: 2.4 GHz and 5 GHz

    Rich set of IoT security features helps developers protect data

    Low-power modes for battery powered application

    Coexistence with 2.4 GHz radios

    Industrial temperature: –40°C to +85°C

    Wi-Fi network processor subsystem:

    Wi-Fi core:

    •802.11 a/b/g/n 2.4 GHz and 5 GHz

    Modes:

    –  Access Point (AP)

    –  Station (STA)

    –Wi-Fi Direct® (only supported 2.4 GHz)

    Security:

    –  WEP

    –  WPA™/ WPA2™ PSK

    –  WPA2 Enterprise

    –  WPA3™ Personal

    Internet and application protocols:

    HTTPs server, mDNS, DNS-SD, DHCP

    IPv4 and IPv6 TCP/IP stack

    16 BSD sockets (fully secured TLS v1.2 and SSL 3.0)

    Built-in power management 

    subsystem:

    Configurable low-power profiles (always on, intermittently connected, tag)

    Advanced low-power modes

    Integrated DC/DC regulators 

    Application throughput

    UDP: 16 Mbps

    TCP : 13 Mbps

    Multilayered Security Features:

    Separate execution environments

    Networking security

    Device identity and key

    Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC)

    File system security (encryption, authentication, access control)

    Initial secure programming

    Software tamper detection

    Secure boot 

    Certificate signing request (CSR)

    Unique per device key pair

    Recovery mechanism – ability to recover to factory defaults

    Power-Management Subsystem:

    Integrated DC/DC converters support a wide range of supply voltage:

    Single wide-voltage supply, VBAT: 2.3 V to 3.6 V

    Advanced low-power modes:

    Shutdown: 1 µA, hibernate: 5.5 µA

    Low-power deep sleep (LPDS): 115 µA

    Idle connected (MCU in LPDS): 710 µA

    RX traffic (MCU active): 53 mA

    TX traffic (MCU active): 223 mA

    Wi-Fi TX power

    2.4 GHz: 16 dBm at 1 DSSS

    5 GHz: 15.1 dBm at 6 OFDM

    Wi-Fi RX sensitivity

    2.4 GHz: –94.5 dBm at 1 DSSS

    5 GHz:  –89 dBm at 6 OFDM

    Additional integrated components on module

    40.0 MHz crystal with internal oscillator

    32.768 kHz crystal (RTC)

    32 Mbit SPI Serial Flash

    RF filters, diplexer, and passive components 

    QFM package

    1.27-mm pitch, 63-pin, 20.5-mm × 17.5-mm QFM package for easy assembly and low-cost PCB design


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