BDE-SG1311P3 is a multiprotocol Sub-1 GHz wireless module supporting IEEE 802.15.4g, IPv6-
enabled smart objects (6LoWPAN), mioty, Wi-SUN®, proprietary systems, including the TI 15.4-
Stack (Sub-1 GHz). The module is based on an Arm® Cortex® M4 main processor and optimized
for low-power wireless communication and advanced sensing in grid infrastructure, building
automation, retail automation, personal electronics and medical applications.
Key Features
Wireless microcontroller
Powerful 48-MHz Arm® Cortex®-M4 processor
352KB flash program memory
32KB of ultra-low leakage SRAM
8KB of Cache SRAM (Alternatively available as
general-purpose RAM)
Programmable radio includes support for 2-
(G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY
and MAC
Supports over-the-air upgrade (OTA)
Low power consumption
MUC consumption
- 2.63 mA active mode, CoreMark
- 55 μA/MHz running CoreMark
- 0.8 μA standby mode, RTC, 32KB RAM
- 0.1 μA shutdown mode, wake-up on pin
Radio Consumption:
- 5.4 mA RX at 868 MHz
- 24.9 mA TX at +14 dBm at 868 MHz
- 64 mA TX at +20 dBm at 915 MHz
Wireless protocols support
mioty
Wireless M-Bus
SimpleLink™ TI 15.4-stack
6LoWPAN
Proprietary systems
High performance radio
-121 dBm for 2.5-kbps long-range mode
-118 dBm at 9.6 kbps narrowband mode, 868
MHz
-110 dBm at 50 kbps, 802.15.4, 868 MHz
Output power up to +20 dBm with temperature
compensation
Down to 4 kHz receiver filter bandwidth
Peripherals
23 GPIOs
Digital peripherals can be routed to any GPIO
Four 32-bit or eight 16-bit general-purpose
timers
12-bit ADC, 200 kSamples/s, 8 channels
8-bit DAC
Two comparators
Programmable current source
UART, SSI, I2C, I2S
Real-time clock (RTC)
Integrated temperature and battery monitor
Security enablers
AES 128-bit cryptographic accelerator
2 / 12
True random number generator (TRNG)
Additional cryptography drivers available in
Software Development Kit (SDK)
Operating range
On-chip buck DC/DC converter
1.8-V to 3.8-V single supply voltage
-40 to +85°C (By default)
-40 to +105°C (Contact for customization)
Antenna
On board U.FL connector (Part Number: BDESG1311P3AU)
RF pad output (Part Number: BDE-SG1311P3N)
Dimension
24.9 mm x 19 mm x 2.15 mm
Standards Conformance
CE-RED (Europe)
FCC (US)
ISED (Canada)
Download
BDE-SG1311P3_Datasheet_V0.1.pdf
BDE-SG1311P3_User_Guide_V1.0.pdf