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Sub-1G - BDE-SG1311P3(Sub-1G with PA Based on CC1311P3)
  • BDE-SG1311P3(Sub-1G with PA Based on CC1311P3)


  • General Description

    BDE-SG1311P3 is a multiprotocol Sub-1 GHz wireless module supporting IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty, Wi-SUN®, proprietary systems, including the TI 15.4-Stack (Sub-1 GHz). The module is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications. 

     

    BDE-SG1311P3 has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The module supports 915/868-MHz bands by default. If you want other bands in Sub-1 GHz to be supported, you can contact us for the customization. The module has an efficient built-in PA that supports +14 dBm TX at 24.9 mA and +20 dBm TX at 64 mA. In RX it has -121 dBm sensitivity and 88 dB blocking ±10 MHz in TI’s SimpleLink™ long-range mode with 2.5-kbps data rate. 

     

    The module has a low sleep current of 0.7 μA with RTC and 32KB RAM retention. 

     

    The module has two options for antenna connection, on board U.FL connector (Part number: BDE-SG1311P3AU) and RF pad output (Part number: BDE-SG1311P3N). The overall dimension of the module is 24.9 mm x 19 mm x 2.15 mm. 


    Key Features


     Wireless microcontroller 

     Powerful 48-MHz Arm® Cortex®-M4 processor 
     352KB flash program memory 
     32KB of ultra-low leakage SRAM 
     8KB of Cache SRAM (Alternatively available as general-purpose RAM) 
     Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC 
     Supports over-the-air upgrade (OTA) 

     Low power consumption 

     MUC consumption 
    - 2.63 mA active mode, CoreMark 
    - 55 μA/MHz running CoreMark 
    - 0.8 μA standby mode, RTC, 32KB RAM 
    - 0.1 μA shutdown mode, wake-up on pin 
     Radio Consumption: 
    - 5.4 mA RX at 868 MHz 
    - 24.9 mA TX at +14 dBm at 868 MHz 
    - 64 mA TX at +20 dBm at 915 MHz 

     Wireless protocols support 

     mioty 
     Wireless M-Bus 
     SimpleLink™ TI 15.4-stack 
     6LoWPAN 
     Proprietary systems 

     High performance radio 

     -121 dBm for 2.5-kbps long-range mode 
     -118 dBm at 9.6 kbps narrowband mode, 868 MHz 
     -110 dBm at 50 kbps, 802.15.4, 868 MHz 
     Output power up to +20 dBm with temperature compensation 
     Down to 4 kHz receiver filter bandwidth 

     Peripherals 

     23 GPIOs 
     Digital peripherals can be routed to any GPIO 
     Four 32-bit or eight 16-bit general-purpose timers 
     12-bit ADC, 200 kSamples/s, 8 channels 
     8-bit DAC 
     Two comparators 
     Programmable current source 
     UART, SSI, I2C, I2S 
     Real-time clock (RTC) 
     Integrated temperature and battery monitor 

     Security enablers 

     AES 128-bit cryptographic accelerator 
     True random number generator (TRNG) 
     Additional cryptography drivers available in Software Development Kit (SDK) 

     Operating range 

     On-chip buck DC/DC converter 
     1.8-V to 3.8-V single supply voltage 
     -40 to +85°C (By default) 
     -40 to +105°C (Contact for customization) 

     Antenna 

     On board U.FL connector (Part Number: BDE-SG1311P3AU)
     RF pad output (Part Number: BDE-SG1311P3N) 

     Dimension 

     24.9 mm x 19 mm x 2.15 mm 
     Standards Conformance 
     CE-RED (Europe) 
     FCC (US) 
     ISED (Canada) 


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