- BDE-SG1312R7(Sub-1G Based on CC1312R7)
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- General Description
The BDE-SG1312R7 is a multiprotocol Sub-1GHz wireless module series based on Texas Instrument (TI)’s single-chip wireless microcontroller (MCU) CC1312R74T0RGZR. In order to fulfil different integration scenarios, BDE provides different variants for this module series. They are listed and described in Table 1.
The BDE-SG1312R7 module series is embeded with an powerful 48-MHz Arm® Cortex®-M4F processor which supports IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), mioty, Wi-SUN, proprietary systems including TI 15.4-Stack (Sub-1GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The module series is optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.
The BDE-SG1312R7 has a low standby current of 0.9 μA with RTC and 144KB RAM retention, which enables longer battery life wireless applications. The module supports +14 dBm output power with best-in-class transmit current consumption at 24.9 mA for Sub-1GHz operation. This is suitable for the long-range and low-power applications. It is featured with the Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events. The device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1-μA system current.
The module series has a software defined radio powered by an Arm® Cortex® M0 which allows support for multiple physical layers and RF standards. PHY and frequency switching can be done runtime through a dynamic multiprotocol manager (DMM) driver.
The module series integrates all required system-level hardware components including clocks, balun filter, other passives, and PCB trace antenna or U.FL connector into a small PCB form factor. It is for easy assembly and low-cost PCB design.
The module is pre-certified with FCC, ISED, CE to make easy integration and fast time-to-market for customers.
Table 1. Module VariantsOrderable Part Number
Antenna Options
On-Board SPI Flash (Mbit)
Operating Temperature
BDE-SG1312R7U32
U.FL Connector
32
-40 °C to +85 °C
BDE-SG1312R7N32
ANT Pin
BDE-SG1312R7U0
U.FL Connector
0
BDE-SG1312R7N0
ANT Pin
BDE-SG1312R7U32-IN
U.FL Connector
32
-40 °C to +105 °C
BDE-SG1312R7N32-IN
ANT Pin
BDE-SG1312R7U0-IN
U.FL Connector
0
BDE-SG1312R7N0-IN
ANT Pin
Key Features
Wireless microcontroller Powerful 48-MHz Arm® Cortex®- M4F processor 704 KB flash program memory 256 KB of ROM for protocols and library functions 8 KB of cache SRAM 144KB of ultra-low leakage SRAM with parity for high-reliability operation Dynamic multiprotocol manager (DMM) driver Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC Supports over-the-air upgrade (OTA) Ultra-low power sensor controller Autonomous MCU with 4 KB of SRAM Sample, store, and process sensor data Fast wake-up for low-power operation Software defined peripherals, capacitive touch, flow meter, LCD Low power consumption MCU consumption: 2.63 mA active mode, CoreMark® 55 μA/MHz running CoreMark® 0.8 μA standby mode, RTC, 144 KB RAM 0.1 μA shutdown mode, wake-up on pin Ultra low-power sensor controller consumption: 25.2 μA in 2 MHz mode 701 μA in 24 MHz mode Radio Consumption: 5.4 mA RX at 868 MHz 24.9 mA TX at +14 dBm at 868 MHz Wireless protocol support Wi-SUN Mioty Amazon Sidewalk Wireless M-Bus SimpleLink™ TI 15.4-stack 6LoWPAN Proprietary systems High performance radio –120 dBm for 2.5 kbps long-range mode –110 dBm at 50 kbps, 802.15.4, 868 MHz MCU peripherals Most digital peripherals can be routed to any GPIO Four 32-bit or eight 16-bit general-purpose timers 12-bit SAR ADC, 200 ksps, 8 channels 8-bit DAC Two comparators Programmable current source Two UART, two SSI, I2C, I2S Real-time clock (RTC) Integrated temperature and battery monitor 30 GPIOs – none SPI flash versions 26 GPIOs – SPI flash versions Security enablers Supports secure boot Supports secure key storage and device ID Arm® TrustZone® for trusted execution environment AES 128- and 256-bit cryptographic accelerator Public key accelerator SHA2 Accelerator (full suite up to SHA-512) True random number generator (TRNG) Secure debug lock Software anti-rollback protection Operating range On-chip buck DC/DC converter 1.8 V to 3.8 V single supply voltage 2.3-V to 3.6-V single supply voltage (SPI flash variants) -40 to +85°C or -40 to 105°C Antenna options U.FL connector for external antenna ANT Pin for external antenna On-board SPI Flash 32-Mbit, only available in SPI flash versions Package Dimension: 22 mm x 15 mm x 2.15 mm LCC-39 RoHS-compliant package Regulatory compliance FCC ID: 2ABRU-SG13R IC: 25657-SG13R CE-RED - Pre: BDE-SG1311P3(Sub-1G with PA Based on CC1311P3)
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