BDE-WF3200 is a Wi-Fi® module series consisting of CC3200R1M2RGC single-chip wireless microcontroller (MCU). This series provides three options: BDE-WF3200A32 (Integrated PCB antenna version), BDE-WF3200AU32 (U.FL connector version) and BDE-WF3200N32 (No antenna version). Customer can choose the suitable version for different application scenario.

Created for the IoT, the BDE-WF3200 is a wireless MCU module that integrates an Arm® Cortex®-M4 MCU, allowing customers to develop an entire application with one device. With on-chip Wi-Fi, Internet, and robust security protocols, no prior Wi-Fi experience is required for faster development. The BDE-WF3200 integrates all required system-level hardware components including clocks, SPI Flash, and passives into a QFM package for easy assembly and low-cost PCB design.

The applications MCU subsystem contains an industry-standard Arm® Cortex®-M4 core running at 80 MHz. The device includes a wide variety of peripherals, including a fast parallel camera interface, I2S, SD/MMC, UART, SPI, I2C, and four-channel ADC. The CC3200 family includes flexible embedded RAM for code and data; ROM with external serial Flash bootloader and peripheral drivers; and SPI Flash for Wi-Fi network processor service packs, Wi-Fi certificates, and credentials.

The Wi-Fi network processor subsystem features a Wi-Fi Internet-on-a chip™ and contains an additional dedicated Arm® MCU that completely off-loads the applications MCU. This subsystem includes an 802.11 b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure Internet connections with 256-bit encryption. The BDE-WF3200 supports station, access point, and Wi-Fi Direct modes. The device also supports WPA2 personal and enterprise security and WPS 2.0. The Wi-Fi Internet-on-a-chip includes embedded TCP/IP and TLS/SSL stacks, HTTP server, and multiple Internet protocols. The power-management subsystem includes integrated DC/DC converters supporting a wide range of supply voltages. This subsystem enables low-power consumption modes, such as the hibernate with RTC mode requiring less than 7 μA of current.

Key Features

 BDE-WF3200 is a Wi-Fi module consisting of CC3200R1M2RGC single-chip wireless microcontroller (MCU)

 Fully integrated module includes all required clocks, SPI Flash, and passives

 Modular FCC, IC, and CE certifications save customer effort, time, and money

 1.27-mm pitch QFM package for easy assembly and low-cost PCB design

 Applications MCU subsystem:

 Arm® Cortex®-M4 core at 80 MHz

 Embedded memory:

 Integrated serial 32Mbit Flash

 RAM (up to 256KB)

 Peripheral drivers in ROM

 Hardware crypto engine for advanced hardware security including:

 AES, DES, and 3DES

 SHA and MD5

 CRC and Checksum

 8-Bit parallel camera

 One Multichannel Audio Serial Port (McASP) interface with support for I2S format

 One SD (MMC) interface

 32-channel Micro Direct Memory Access (μDMA)

 Two Universal Asynchronous Receivers and Transmitters (UARTs)

 Two Serial Peripheral Interfaces (SPIs)

 One Inter-integrated Circuit (I2C)

 Four General-Purpose Timers (GPTs)

 16-Bit Pulse-Width Modulation (PWM) mode

 One Watchdog Timer Module

 4-channel, 12-bit Analog-to-Digital Converters (ADCs)

 Up to 25 individually programmable GPIO pins

 Wi-Fi network processor subsystem:

 802.11 b/g/n radio, baseband, and medium access control

 TCP/IP Stack

 Eight simultaneous TCP, UDP, or RAW sockets

 Two simultaneous TLS v1.2 or SSL 3.0 sockets

 ARP, ICMP, DHCP, DNS, and mDNS support

 HTTP server with built-in programmable HTML page for over-the-network device configuration

 Powerful crypto engine for fast, secured WLAN connections with 256-bit encryption

 Station, Access Point, and Wi-Fi Direct® Modes

 WPA2 personal and enterprise security

 SimpleLink™ connection manager for managing Wi-Fi security states

 TX power:

 17 dBm at 1 DSSS

 17 dBm at 11 CCK

 13 dBm at 54 OFDM

 RX sensitivity:

 -94 dBm at 1 DSSS

 -87 dBm at 11 CCK

 -73 dBm at 54 OFDM

 Application Throughput:

 UDP: 16 Mbps

 TCP: 13 Mbps

 Power-management subsystem:

 Integrated DC/DC converter with a wide-supply voltage:

 VBAT: 2.3 to 3.6 V

 Low-power consumption at 3.6 V:

 Hibernate with Real-Time Clock (RTC): 7 μA

 Low-Power Deep Sleep: <275 μA

 RX Traffic: 59 mA at 54 OFDM

 TX Traffic: 229 mA at 54 OFDM

 Package and operating conditions:

 1.27-mm pitch, 63-Pin, 20.5-mm × 25-mm (BDE-WF3200A32/BDE-WF3200AU32) and 20.5-mm × 17.5-mm (BDE-WF3200N32) QFM package for easy assembly and low-cost PCB design

 Operating temperature range: -20°C to +70°C

 Additional integrated components:

 40.0-MHz crystal

 32.768-kHz crystal (RTC)

 32-Mbit SPI Serial Flash

 RF filter and passive components

 Antenna:

 BDE-WF3200A32: Integrated PCB antenna

 BDE-WF3200AU32: U.FL connector for connecting external antenna

 BDE-WF3200N32: No antenna included, RF pad for connecting external antenna

Applications

 Internet-of-Things (IoT)

 Home appliances

 Building automation

 Security systems

 Smart energy

 Internet Gateway

 Industrial control

 Smart Plug and Metering

 Wireless communications

 Wearables 

Datasheet: BDE-WF3200_Datasheet_V0.1.pdf