BDE-HWF7394N is an ultra-low power & long-range Wi-Fi module based on IEEE 802.11ah, a new Wi-Fi standard operating in the Sub 1GHz license-exempt band, offering longer range and lower power connectivity necessary for internet of things (IoT) applications.

The module can operate at frequency range from 740 MHz to 950 MHz for different countries/regions.

With the internal PA in SoC, the module can increase transmission power up to 16 dBm. It outputs the accurate power for each channel through the temperature sensor integrated in the SoC and calibration at the factory. On-board serial flash can be used for user application program and OTA software update and store MAC address, calibration data and information. It also can support execution in place (XIP) feature with a 16KB internal cache memory.

 Standard

 Full IEEE 802.11ah compatibility with enhanced performance

 1/2/4 MHz channel bandwidth, up to 15Mbps data rate

 WPA2/WPA3/WPS support

 Support transmission of standby radio frame

 Radio Frequency

 +16 dBm transmit power

 -106 dBm minimum receive sensitivity (MCS10)

 740~950 MHz frequency band by different module variants

 Main Interface

 UART and SPI support for host interface

 Peripherals

 GPIO, AUXADC

 I2C, SPI and UART

 RF Transceiver

 Based on the industry-proven direct conversion transceiver architecture

 Includes a complete radio front-end part, which consists of a TX power amplifier and an LNA

 Integrated LDOs

 Wide supply voltage supportable with an integrated DC-DC buck converter

 Usable battery voltage range: 2.1V ~ 3.6V

 Radio calibration interfaces for digital baseband

 Internal temperature sensing and battery voltage monitoring

 Low supply current: 

 RX 15 mA @ 3.3V

 TX 190 mA @ 3.3V @ +15 dBm

 Modulation bandwidth: 1/2/4 MHz

 RX noise figure < 6dB

 RX gain range: > 100dB

 RX IIP3: -17dBm @ LNA maximum gain

 Linear output power: +15 dBm

 TX gain range: > 30 dB

 EVM < -30 dB @ +15 dBm (w/ 64 QAM, DPD)

 Integrated RF PLL phase error < 0.7 degree

 BUS Sub-System

 Firmware code can be stored and executed in external flash memory using XIP (execute-in-place) interface

 System Peripherals

 3 channel 32-bit timers

 1 channel 64-bit timers

 1 channel 32-bit watchdog timers

 1 channel 64-bit RTC with offset estimator

 Serial flash controller for XIP with cache (16KB cache memory)

 General Direct Memory Controller

 8 DMA channels with 2 AHB masters

 16 controls for communicating with peripherals

 Data Peripherals

 Max 20 general purpose I/Os

 1 HSPI(Host SPI) for host interface

 2 channel SPIs master/slave

 2 channel HSUARTs, up to 115200 baud rate

 2 channel I2C masters

 4 channel PWM generator

 10-bit ADC: 2ch input

 MAC

 Basic features: S1G Beacon, NDP Control frame, TIM compression, unified scaling factor for max idle period/listen interval/WNM-sleep interval, STA Type, S1G baseline functions (DCF, HCF, multi-rate support, A-MPDU), and S1G BSS operation

 Network efficiency enhancements: NDP PS-Poll/PS-Poll Ack/Probe Resp., Raw avoidance, TSBTT, and differentiated EDCA parameter

 Power saving: Non-TIM operation, dynamic AID assignment and TWT

 BSS scalability (up to 8192 STAs): Multicast AID, and authentication control

 Low-cost STA/AP: EL operation, flow control

 Supports transmission of Standby Radio frame

 PHY

 Full IEEE 802.11ah compatibility with enhanced performance

 Single-stream up to 15Mbps data rate

 Support 1/2/4 MHz channel with optional SGI

 Support S1G_1M, Short/Long format

 Modulation: OFDM with BPSK, QPSK, 16QAM, 64QAM

 Memory

 32KB Boot ROM

 1088KB system SRAM

 SRAM0: 512KB

 SRAM1: 320KB

 SRAM2: 192KB

 SRAM3: 16KB

 SRAM4: 48KB (Retention)

 192KB Key memory for security

 This memory could be used as additional 192KB SRAM2 in non-key memory & boot mode

 16KB cache for XIP

 This memory could be used as additional 16KB SRAM3 in non-cache & boot mode

 On-board 4Mbyte serial flash for XIP

 Antenna

 ANT pin for external antenna

 Regulatory

 FCC

 IC

 CE

 Package

 Dimension: 13.5 mm x 13.5 mm x 2.1 mm

Datasheet:BDE-HWF7394N_Datasheet_V0.1.pdf