Bluetooth/WiFi Combo - BDE-BW3301xPx series(TI CC3301 2.4GHz Wi-Fi6 & BLE, -40°C to 105°C)
- BDE-BW3301xPx series(TI CC3301 2.4GHz Wi-Fi6 & BLE, -40°C to 105°C)
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General Description
BDE-BW3301xP1 is a 2.4-GHz Wi-Fi 6 and Bluetooth Low Energy 5.4 combo wireless module series based on TI’s CC3301. This module series is ideal for cost-sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the peak application throughput requirement is a maximum of 50 Mbps and also has requirement for BLE connectivity. The BDE-BW3301xP1 module series is an excellent choice for bringing the efficiency of Wi-Fi 6 to embedded device applications, featuring a small PCB footprint and a highly optimized bill of materials for lower costs. Additionally, the module is backward compatible with Wi-Fi 4 (802.11 b/g/n) and Wi-Fi 5 (802.11 ac).
Key Features
Highly optimized Wi-Fi 6 (802.11 ax) and Bluetooth Low Energy 5.4 system for low cost embedded IoT applications
Seamless integration with any processor or MCU host capable of running a TCP/IP stack
Integrated 2.4-GHz PA for complete wireless solution with up to +20 dBm output power
Application throughput up to 50 Mbps
Wi-Fi 6
2.4 GHz, 20 MHz, single spatial stream
MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax
Target wake time (TWT), OFDMA, MU-MIMO (Downlink), Basic Service Set Coloring, and trigger frame for improved efficiency
Hardware-based encryption and decryption supporting WPA2 and WPA3
Excellent interoperability
Support for 4 bit SDIO or SPI host interfaces
Bluetooth Low Energy 5.4
LE Coded PHYs (Long Range), LE 2M PHY (High Speed) and Advertising Extension
Host Controller Interface (HCI) transport with option for UART or shared SDIO
Enhanced Security
Secured host interface
Firmware authentication
Anti-rollback protection
Multirole support (for example, concurrent STA and AP) to connect with Wi-Fi devices on different RF channels (Wi-Fi networks)
3-wire or 1-wire PTA for external coexistence with additional 2.4-GHz radios (for example, Thread or Zigbee)
Operating temperature: -40°C to +85°C or -40°C to +105°C
Power Management
VDD_1V8: 1.62 V - 1.98 V
VDD_3V3: 3 V – 3.6 V
Clock Source
On-board 40 MHz XTAL fast clock
Internal slow clock or external 32.768-kHz slow clock
Antenna Options
ANT pin for external antenna
U.FL connector for external antenna
Integrated PCB trace antenna
Package
LGA-64, 13.3-mm x 13.4-mm x 2-mm
LGA-64, 13.3-mm x 18.4-mm x 2-mm
Pin to Pin Compatible with TI’s WL1837MOD (-N variants)
Pin to Pin Compatible with BDE’s BDE-BW2837 (-N variants)
Qualification and Regulatory Compliance
Bluetooth SIG, DID/DN: D067335
FCC ID: 2ABRU-BW330P1
IC: 25657-BW330P1
MIC: 219-248271
CE-RED
Download:
Datasheet:
User Guide:
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