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Bluetooth Low Energy - BDE-LE2340R5KP
  • BDE-LE2340R5KP

  •  (Bluetooth 5.3 Low Energy Based on CC2340R Pre-release) 

    BDE-LE2340R5KP is a Bluetooth 2.4GHz wireless module series consisting of CC2340R52E0RKPR single-chip wireless microcontroller (MCU). This series provides below six options, customer can choose the suitable version for different application scenario.

    BDE-LE2340R5KPA32 (with chip antenna and on-board 32M-bit SPI flash)
    BDE-LE2340R5KPU32 (with U.FL connector and on-board 32M-bit SPI flash)
    BDE-LE2340R5KPN32 (without antenna and with on-board 32M-bit SPI flash) 
    BDE-LE2340R5KPA0 (with chip antenna and without on-board 32M-bit SPI flash)
    BDE-LE2340R5KPU0 (with U.FL connector and without on-board 32M-bit SPI flash)
    BDE-LE2340R5KPN0 (without antenna and without on-board 32M-bit SPI flash) 

    The BDE-LE2340R5KP is a Bluetooth 2.4G wireless module that integrates an Arm® Cortex®-M0+ MCU, which supports Bluetooth ® 5.3 Low Energy, Zigbee, SimpleLink™ TI 15.4-stack, Proprietary systems. This device is optimized for low-power wireless communication with on-chip dual image Over the Air Download (OAD) support in Building automation (wireless sensors, lighting control, beacons), asset tracking, medical, retail EPOS (electronic point of sale), ESL (electronic shelf label), and Personal electronics (toys, HID, stylus pens) markets.

    The BDE-LE2340R5KP supports operation in the 2360 to 2510-MHz frequency band. It can support +8 dBm output power in 2.4GHz band, and a receive sensitivity of -102 dBm for 125-kbps Bluetooth® Low Energy Coded PHY. The BDE-LE2340R5KP has an ultra-low standby current less than 0.71 μA with RTC operational and full RAM retention that enables significant battery life extension especially for applications with longer sleep intervals. The module supports for Bluetooth® 5 features: High Speed Mode (2 Mbps PHY), Long Range (LE Coded 125 kbps and 500 kbps PHYs), Privacy 1.2.1 and Channel Selection Algorithm #2, as well as backwards compatibility and support for key features from the Bluetooth® 4.2 and earlier Low Energy specifications.

    The BDE-LE2340R5KP highly integrates radio, stack, profile and applications in a SoC, without the need of using an external MCU. The module also offers flexible hardware interfaces for the sensor application. It enables ultra-low power connectivity and data transfer for the applications that are sensitive to power consumption, size and cost.

    Key Features
    BDE-LE2340R5KP is a Bluetooth 2.4GHz module consisting of CC2340R52E0RKPR single-chip wireless microcontroller (MCU)
    Fully integrated module includes all required clocks and passives
    Wireless microcontroller
    - Optimized 48-MHz Arm® Cortex®-M0+ processor
    - Integrated 32M-bit SPI Flash
    - BDE-LE2340R5KPA32
    - BDE-LE2340R5KPU32
    - BDE-LE2340R5KPN32
    - 512KB of in-system programmable flash
    - 12KB of ROM for bootloader and drivers
    - 36KB of ultra-low leakage SRAM. Full RAM retention in standby mode
    2.4 GHz RF transceiver compatible with Bluetooth®5.3 Low Energy
    Supports over-the-air upgrade (OTA)
    Serial Wire Debug (SWD)
    Low power consumption
    - MCU consumption:
    - 2.6 mA active mode, CoreMark®
    - 53 μA/MHz running CoreMark®
    - <710 nA standby mode, RTC, 36KB RAM
    - 150 nA shutdown mode, wake-up on pin
    - Radio Consumption:
    - 5.3 mA RX
    - 5.1 mA TX at +0 dBm
    - <11.0 mA TX at +8 dBm
    Wireless protocol support
    - Bluetooth®5.3 Low Energy
    - Zigbee®
    - SimpleLink™ TI 15.4-stack
    - Proprietary systems
    High performance radio
    - -102 dBm for Bluetooth® Low Energy 125-kbps
    - -96.5 dBm for Bluetooth® Low Energy 1 Mbps
    - Output power up to +8 dBm with temperature compensation
    Regulatory compliance (On-going)
    - FCC
    - IC
    - CE-RED
    MCU peripherals
    - Up to 26 I/O Pads
    - 2 IO pads SWD, muxed with GPIOs
    - 2 IO pads LFXT, muxed with GPIOs
    - Up to 22 DIOs (analog or digital IOs)
    - Three 16-bit or one 124-bit general-purpose timers, quadrature decode mode support
    - 12-bit ADC, 1.2 Msps with external reference, 267 ksps with internal reference, up to 12 external ADC inputs
    - One low power comparator
    - UART, SPI, I2C
    - Real-time clock (RTC)
    - Integrated temperature and battery monitor
    - Watchdog timer
    - Security enablers
    - AES 128-bit cryptographic accelerator
    - Random number generator from on-chip analog noise
    Operating range
    - On-chip buck DC/DC converter
    - 1.71-V to 3.8-V single supply voltage
    - -40 to +85℃
    - Dimension: 
    - 12 mm x 15 mm x 2.15 mm (With Shielding) – A/U versions
    - 12 mm x 10.2 mm x 2.15 mm (With Shielding) – N versions
    - QFM-50 (20 GPIOs)
    - BDE-LE2340R5KPA32
    - BDE-LE2340R5KPU32
    - BDE-LE2340R5KPN32
    - QFM-50 (24 GPIOs)
    - BDE-LE2340R5KPA0
    - BDE-LE2340R5KPU0
    - BDE-LE2340R5KPN0
    RoHS-compliant package
    - BDE-LE2340R5KPA32/BDE-LE2340R5KPA0: chip antenna
    - BDE-LE2340R5KPU32/BDE-LE2340R5KPU0: U.FL connector for connecting external antenna
    - BDE-LE2340R5KPN32/BDE-LE2340R5KPN0: No antenna included, RF pad for connecting external antenna
    Additional integrated components:
    - 48.0-MHz crystal
    - 32.768-kHz crystal (RTC)
    - 32M-bit SPI Serial Flash
    - BDE-LE2340R5KPA32
    - BDE-LE2340R5KPU32
    - BDE-LE2340R5KPN32
    - RF filter and passive components
    Building automation
    Factory automation and control
    Retail automation & payment – Electronic point of sale
    Communication equipment
    Personal electronics


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