General Description                         

BDE-LE2340R52KP is a Bluetooth 2.4GHz wireless module series consisting of CC2340R52E0RKPR single-chip wireless microcontroller (MCU). In order to fulfil different application scenarios, we provide different variants for this module. They are listed as follows:

 BDE-LE2340R52KPA32 – Integrated PCB antenna and on-board 32M-bit SPI flash

 BDE-LE2340R52KPU32 – Integrated U.FL connector and on-board 32M-bit SPI flash

 BDE-LE2340R52KPN32 – RF pad out for antenna and on-board 32M-bit SPI flash

 BDE-LE2340R52KPA0 – Integrated PCB antenna and no on-board 32M-bit SPI flash

 BDE-LE2340R52KPU0 – Integrated U.FL connector and no on-board 32M-bit SPI flash

 BDE-LE2340R52KPN0 – RF pad out for antenna and no on-board 32M-bit SPI flash 

The BDE-LE2340R52KP is a Bluetooth 2.4G wireless module that integrates an Arm® Cortex®-M0+ MCU, which supports Bluetooth ® 5.3 Low Energy, ZigBee, SimpleLink™ TI 15.4-stack, Proprietary systems. This device is optimized for low-power wireless communication with on-chip dual image Over the Air Download (OAD) support in Building automation (wireless sensors, lighting control, beacons), asset tracking, medical, retail EPOS (electronic point of sale), ESL (electronic shelf label), and Personal electronics (toys, HID, stylus pens) markets.

The BDE-LE2340R52KP supports operation in the 2360 to 2510-MHz frequency band. It can support +8 dBm output power in 2.4GHz band, and a receive sensitivity of -102 dBm for 125-kbps Bluetooth® Low Energy Coded PHY. The BDE-LE2340R52KP has an ultra-low standby current less than 0.71 μA with RTC operational and full RAM retention that enables significant battery life extension especially for applications with longer sleep intervals. The module supports for Bluetooth® 5 features: High Speed Mode (2 Mbps PHY), Long Range (LE Coded 125 kbps and 500 kbps PHYs), Privacy 1.2.1 and Channel Selection Algorithm #2, as well as backwards compatibility and support for key features from the Bluetooth® 4.2 and earlier Low Energy specifications.

The BDE-LE2340R52KP highly integrates radio, stack, profile and applications in a SoC, without the need of using an external MCU. The module also offers flexible hardware interfaces for the sensor application. It enables ultra-low power connectivity and data transfer for the applications that are sensitive to power consumption, size and cost.

 

 BDE-LE2340R52KP is a Bluetooth 2.4GHz module consisting of CC2340R52E0RKPR single-chip wireless microcontroller (MCU)

 Fully integrated module includes all required clocks and passives

 Wireless microcontroller

 Optimized 48-MHz Arm® Cortex®-M0+ processor

 Integrated serial 32M-bit Flash

 BDE-LE2340R52KPA32

 BDE-LE2340R52KPU32

 BDE-LE2340R52KPN32

 512KB of in-system programmable flash

 12KB of ROM for bootloader and drivers

 36KB of ultra-low leakage SRAM. Full RAM retention in standby mode

 2.4 GHz RF transceiver compatible with Bluetooth®5.3 Low Energy

 Supports over-the-air upgrade (OTA)

 Serial Wire Debug (SWD)

 Low power consumption

 MCU consumption:

 2.6 mA active mode, CoreMark®

 53 μA/MHz running CoreMark®

 <710 nA standby mode, RTC, 36KB RAM

 150 nA shutdown mode, wake-up on pin

 Radio Consumption:

 5.3 mA RX

 5.1 mA TX at +0 dBm

 <11.0 mA TX at +8 dBm

 Wireless protocol support

 Bluetooth®5.3 Low Energy

 Zigbee®

 SimpleLink™ TI 15.4-stack

 Proprietary systems

 High performance radio

 -102 dBm for Bluetooth® Low Energy 125-kbps

 -96.5 dBm for Bluetooth® Low Energy 1 Mbps

 Output power up to +8 dBm with temperature compensation

 Regulatory compliance (On-going)

 Bluetooth

 FCC

 IC

 CE-RED

 MCU peripherals

 Up to 26 I/O Pads

 2 IO pads SWD, muxed with GPIOs

 2 IO pads LFXT, muxed with GPIOs (On-board LFXT populated by default, these two IOs are not exposed by default)

 Up to 22 DIOs (analog or digital IOs)

 Three 16-bit or one 124-bit general-purpose timers, quadrature decode mode support

 12-bit ADC, 1.2 Msps with external reference, 267 ksps with internal reference, up to 12 external ADC inputs

 One low power comparator

 UART, SPI, I2C

 Real-time clock (RTC)

 Integrated temperature and battery monitor

 Watchdog timer

 Security enablers

 AES 128-bit cryptographic accelerator

 Random number generator from on-chip analog noise

 Operating range

 On-chip buck DC/DC converter

 1.71-V to 3.8-V single supply voltage (None-SPI flash version)

 2.3-V to 3.6-V single supply voltage (SPI flash version)

 -40 to +85℃

 Package

 Dimension: 

 11.5 mm x 13.5 mm x 2.0 mm (-A, -U versions)

 11.5 mm x 9.70 mm x 2.0 mm (-N versions)

 RoHS-compliant package

 Antenna:

 BDE-LE2340R52KPA32/BDE-LE2340R52KPA0: integrated PCB antenna

 BDE-LE2340R52KPU32/BDE-LE2340R52KPU0: U.FL connector for connecting external antenna

 BDE-LE2340R52KPN32/BDE-LE2340R52KPN0: No antenna included, RF pad for connecting external antenna

 Additional integrated components:

 48.0-MHz crystal

 32.768-kHz crystal (RTC)

 32M-bit SPI Serial Flash

 BDE-LE2340R52KPA32

 BDE-LE2340R52KPU32

 BDE-LE2340R52KPN32

 RF filter and passive component 

 

 Medical

 Building automation

 Lighting

 Factory automation and control

 Retail automation & payment – Electronic point of sale

 Communication equipment

 Personal electronics