BDE-LE2340R22KP is a Bluetooth® 5.3 Low Energy and Proprietary 2.4-GHz wireless module series based on Texas Instrument (TI)’s single-chip wireless microcontroller (MCU) CC2340R22E0RKPR. In order to fulfil different integration scenarios, we provide different variants for this module series.

BDE-LE2340R22KP module series integrates an Arm® Cortex®-M0+ MCU, which supports Bluetooth® 5.3 Low Energy, ZigBee®, SimpleLink™ TI 15.4-stack and Proprietary systems. This device is optimized for low-power wireless communication with on-chip dual image Over the Air Download (OAD) support in building automation (wireless sensors, lighting control, beacons), asset tracking, medical, retail EPOS (electronic point of sale), ESL (electronic shelf label), and personal electronics (toys, HID, stylus pens) markets.

BDE-LE2340R22KP module series can support up to +8 dBm output power and a receive sensitivity of -102 dBm for 125 kbps Bluetooth® Low Energy Coded PHY. It is with ultra-low standby current less than 0.71 μA with RTC operational and full RAM retention that enables significant battery life extension especially for applications with longer sleep intervals. The module series supports for Bluetooth® 5 features: High Speed Mode (2 Mbps PHY), Long Range (LE Coded 125 kbps and 500 kbps PHYs), Privacy 1.2.1 and Channel Selection Algorithm #2, as well as backwards compatibility and support for key features from the Bluetooth® 4.2 and earlier Low Energy specifications.

BDE-LE2340R22KP module series highly integrates the radio with required passives, high-frequency clock, low-frequency clock, filter, antenna, ect., and also a fully-qualified Bluetooth® 5.3 software protocol stack and profiles from TI. It can work standalone without using an external MCU. With its best-in-class radio performance, ultra-low power, small form factor and low cost, the BDE-LE2340R22KP module series is the best choice for the applications that are sensitive to power consumption, size and cost.

Key Features

 Wireless microcontroller

 Optimized 48-MHz Arm® Cortex®-M0+ processor

 256 KB of in-system programmable flash

 12 KB of ROM for bootloader and drivers

 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mode

 Integrated 32-Mbit SPI flash, only available in SPI flash versions

 2.4-GHz RF transceiver compatible with Bluetooth®5.3 Low Energy and IEEE 802.15.4 PHY and MAC

 Supports over-the-air upgrade (OTA)

 Serial Wire Debug (SWD)

 Low power consumption

 MCU consumption:

 2.6 mA active mode, CoreMark®

 53 μA/MHz running CoreMark®

 <710 nA standby mode on BDE-LE2340R52KP Series

 165 nA shutdown mode, wake-up on pin

 Radio Consumption:

 5.3 mA RX

 5.1 mA TX at +0 dBm

 <11.0 mA TX at +8 dBm

 Wireless protocol support

 Bluetooth® 5.3 Low Energy

 Zigbee®

 Thread

 Proprietary systems

 High performance radio

 -102 dBm for Bluetooth® Low Energy 125 kbps

 -96.5 dBm for Bluetooth® Low Energy 1 Mbps

 -98 dBm for IEEE 802.15.4 (2.4 GHz)

 Output power up to +8 dBm with temperature compensation

 MCU peripherals

 Up to 26 I/O Pads

 2 IO pads SWD, muxed with GPIOs

 2 IO pads LFXT, muxed with GPIOs (On-board LFXT populated by default, these two IOs are not exposed by default)

 Up to 22 DIOs (analog or digital IOs)

 3x 16-bit or 1x 24-bit general-purpose timers, quadrature decode mode support

 12-bit ADC, 1.2 Msps with external reference, 267 ksps with internal reference, up to 12 external ADC inputs

 1x low power comparator

 1x UART

 1x SPI

 1x I2C

 Real-time clock (RTC)

 Integrated temperature and battery monitor

 Watchdog timer

 Security enablers

 AES 128-bit cryptographic accelerator

 Random number generator from on-chip analog noise

 Operating range

 1.71-V to 3.8-V single supply voltage 

 2.3-V to 3.6-V single supply voltage (SPI flash variants)

 Operating temperature range: 

 -40℃ to +85℃

 -40℃ to +105℃ (-IN variants)

 Package

 Dimension: 

 11.5 mm x 13.5 mm x 2.0 mm (BDE-LE2340RKPA and BDE-LE2340RKPU variants)

 11.5 mm x 9.70 mm x 2.0 mm (BDE-LE2340RKPN variants)

 RoHS-compliant package

 Antenna

 BDE-LE2340RKPA variants: Integrated PCB Trace antenna

 BDE-LE2340RKPU variants: U.FL connector for external antenna

 BDE-LE2340RKPN variants: ANT pin for external antenna

 Additional integrated components

 48.0-MHz HFXT

 32.768-kHz LFXT

 32-Mbit SPI flash

 BDE-LE2340R53KPX32(-IN)

 BDE-LE2340R52KPX32(-IN)

 BDE-LE2340R22KPX32(-IN)

 RF filter and passive components 

 Regulatory compliance

 FCC ID: 2ABRU-LE2340RKP

 IC: 25657-LE2340RKP

 CE-RED

 Bluetooth SIG

Download

Datasheet:

BDE-LE2340RKP_Datasheet_V1.0.pdf