- BDE-SG1314R10 (Sub-1G Based on CC1314R10)
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- General Description
The BDE-SG1314R10 is a low-power Sub-1GHz wireless module series based on Texas Instruments (TI)’s single-chip wireless microcontroller (MCU) CC1314R106T0RGZ. In order to fulfil different integration scenarios, BDE provides different variants for this module series. They are listed and described in Table 1.
The BDE-SG1314R10 module series is embeded with an powerful 48-MHz Arm® Cortex®-M33 processor with TrustZone® based secure key storage, device ID and trusted functions, and it supports IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), Wireless M-Bus, Wi-SUN, Amazon Sidewalk, mioty, and proprietary systems including TI 15.4-Stack (Sub-1GHz).
The module series is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, smart meters, medical, wired networking, gateways and grid communications, home theater & entertainment, and connected peripherals markets.
The BDE-SG1314R10 has a low standby current of 0.98 μA with full RAM retention, which enables longer battery life wireless applications. The module supports +14 dBm output power with best-in-class transmit current consumption at 25.8 mA for Sub-1GHz operation. This is suitable for the long-range and low-power applications. It is featured with the Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events. The device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1.2-μA system current.
The module series has a software defined radio powered by an Arm® Cortex® M0 which allows support for multiple physical layers and RF standards. PHY and frequency switching can be done runtime through a dynamic multiprotocol manager (DMM) driver.
The module series integrates all required system-level hardware components including clocks, balun filter, other passives, and U.FL connector into a small PCB form factor. It is for easy assembly and low-cost PCB design.
The module is pre-certified with FCC, ISED, CE-RED to make easy integration and fast time-to-market for customers.
Table 1. Module VariantsOrderable Part Number
Antenna Options
On-Board SPI Flash (Mbit)
Operating Temperature
BDE-SG1314R10U32
U.FL Connector
32
-40 °C to +85 °C
BDE-SG1314R10N32
ANT Pin
BDE-SG1314R10U0
U.FL Connector
0
BDE-SG1314R10N0
ANT Pin
BDE-SG1314R10U32-IN
U.FL Connector
32
-40 °C to +105 °C
BDE-SG1314R10N32-IN
ANT Pin
BDE-SG1314R10U0-IN
U.FL Connector
0
BDE-SG1314R10N0-IN
ANT Pin
Key Features
Wireless microcontroller
Powerful 48-MHz Arm® Cortex®- M33 processor with TrustZone®
FPU and DSP extension
1024 KB flash program memory
8 KB of cache SRAM
256 KB of ultra-low leakage SRAM with parity for high-reliability operation
32 KB of additional SRAM is available if parity is disabled
Dynamic multiprotocol manager (DMM) driver
Supports over-the-air upgrade (OTA)
Ultra-low power sensor controller
Autonomous MCU with 4 KB of SRAM
Sample, store, and process sensor data
Fast wake-up for low-power operation
Software defined peripherals, capacitive touch, flow meter, LCD
Low power consumption
MCU consumption:
3.4 mA active mode, CoreMark®
71 μA/MHz running CoreMark®
0.98 μA standby mode, RTC, 256 KB RAM
0.17 μA shutdown mode, wake-up on pin
Ultra-low power sensor controller consumption:
32 μA in 2 MHz mode
849 μA in 24 MHz mode
Radio Consumption:
5.8 mA RX at 868 MHz
25.8 mA TX at +14 dBm setting at 868 MHz
Wireless protocol support
Wi-SUN
Mioty
Amazon Sidewalk
Wireless M-Bus
SimpleLink™ TI 15.4-stack (Sub-1GHz)
Proprietary systems
High performance radio
–120 dBm for 2.5 kbps long-range mode
–110 dBm at 50 kbps, 802.15.4, 868 MHz
MCU peripherals
Most digital peripherals can be routed to any GPIO
Four 32-bit or eight 16-bit general-purpose timers
12-bit SAR ADC, 200 ksps, 8 channels
8-bit DAC
Two comparators
Programmable current source
Four UART, four SPI, two I2C, I2S
Real-time clock (RTC)
Integrated temperature and battery monitor
30 GPIOs – none SPI flash versions
26 GPIOs – SPI flash versions
Security enablers
Supports secure boot
Supports secure key storage and device ID
Arm® TrustZone® for trusted execution environment
AES 128- and 256-bit cryptographic accelerator
Public key accelerator
SHA2 Accelerator (full suite up to SHA-512)
True random number generator (TRNG)
Secure debug lock
Software anti-rollback protection
Operating range
On-chip buck DC/DC converter
1.8 V to 3.8 V single supply voltage
2.3-V to 3.6-V single supply voltage (SPI flash variants)
-40 to +85°C or -40 to 105°C
Antenna options
U.FL connector for external antenna
ANT pin for external antenna
On-board SPI flash
32-Mbit, only available in SPI flash versions
Package
Dimension: 22 mm x 15 mm x 2.15 mm
LCC-39
RoHS-compliant package
Regulatory compliance
FCC ID: 2ABRU-SG13R
IC: 25657-SG13R
CE-RED
DownloadDatasheet:
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