General Description

BDE-BW3300xP1 is a 2.4-GHz Wi-Fi 6 wireless module series based on TI’s CC3300. This module series is ideal for cost-sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the peak application throughput requirement is a maximum of 50 Mbps. The BDE-BW3300xP1 module series is an excellent choice for bringing the efficiency of Wi-Fi 6 to embedded device applications, featuring a small PCB footprint and a highly optimized bill of materials for lower costs. Additionally, the module is backward compatible with Wi-Fi 4 (802.11 b/g/n) and Wi-Fi 5 (802.11 ac).

Key Features

 Highly optimized Wi-Fi 6 (802.11ax) system for low cost embedded IoT applications

 Seamless integration with any processor or MCU hosts capable of running a TCP/IP stack

 Integrated 2.4-GHz PA for complete wireless solution with up to +20 dBm output power

 Application throughput up to 50 Mbps

 Wi-Fi 6

 2.4 GHz, 20 MHz, single spatial stream

 MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax

 Target wake time (TWT), OFDMA, MU-MIMO (Downlink), Basic Service Set Coloring, and trigger frame for improved efficiency

 Hardware-based encryption and decryption supporting WPA2 and WPA3

 Excellent interoperability

 Support for 4 bit SDIO or SPI host interfaces

 Enhanced security

 Secured host interface

 Firmware authentication

 Anti-rollback protection

 Multirole support (for example, concurrent STA and AP) to connect with Wi-Fi devices on different RF channels (Wi-Fi networks)

 3-wire or 1-wire PTA for external coexistence with additional 2.4-GHz radios (for example, Thread or Zigbee)

 Operating temperature: -40°C to +85°C or -40°C to +105°C

 Power management

 VDD_1V8: 1.62 V - 1.98 V

 VDD_3V3: 3 V – 3.6 V 

 Clock source

 On-board 40 MHz XTAL fast clock

 Internal slow clock or external 32.768-kHz slow clock

 Antenna options

 ANT pin for external antenna

 U.FL connector for external antenna

 Integrated PCB trace antenna

 Package

 LGA-64, 13.3-mm x 13.4-mm x 2-mm 

 LGA-64, 13.3-mm x 18.4-mm x 2-mm 

 Pin to Pin compatible with TI’s WL1837MOD (-N variants)

 Pin to Pin compatible with BDE’s BDE-BW2837 (-N variants)

 Regulatory compliance

 FCC ID: 2ABRU-BW330P1

 IC: 25657-BW330P1

 TELEC: 219-248271

 CE-RED

BDE-BW3300xP1_Datasheet_V1.0.pdf

BDE-BW3300xP2_Datasheet_V1.0.pdf

BDE-BW33xx_Module_User_Guide_V1.0.pdf