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Bluetooth/WiFi Combo - BDE-BW3300x1 series(TI CC3300 2.4GHz Wi-Fi6, -40°C to 105°C, tiny size)
  • BDE-BW3300x1 series(TI CC3300 2.4GHz Wi-Fi6, -40°C to 105°C, tiny size)

  • General Description          

    BDE-BW3300XX is a 2.4-GHz Wi-Fi 6 and Bluetooth Low Energy Combo wireless module based on TI’s 10th generation connectivity companion chip CC3300 which is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This module is ideal for use in cost sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the peak throughput requirement is 50 Mbps maximum at the IP layer. BDE-BW330XX could be the best choice for bringing the efficiency of Wi-Fi 6 to embedded device applications with a small PCB footprint and highly optimized bill of materials with lower cost.

    In order to fulfil different integration requirements, BDE provides different options including:
    BDE-BW3300N1, single antenna port without antenna;
    BDE-BW3300U1, single antenna port with U.FL connector;
    BDE-BW3300A1, single antenna with integrated PCB trace antenna.

    Key Features
    Highly optimized Wi-Fi 6 and Bluetooth Low Energy 5.2 system for low cost embedded IoT applications 
    Seamless integration with TI Sitara MPU (Linux) / MCU+ (FreeRTOS) as well as other application processors 
    3-wire or 1-wire PTA for external coexistence with additional 2.4GHz radios (e.g. Thread or Zigbee) 
    Multirole support e.g. STA and AP to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)
    Optional antenna diversity or selection 
    Operating temperature: -40°C to +85°C
    Wi-Fi 6®
    MAC, Baseband and RF Transceiver with support for IEEE 802.11 a/b/g/n/ax Wi-Fi6
    Medium access controller (MAC)
    Hardware-based encryption and decryption using supporting WPA2 and WPA3
    TWT and OFDMA for optimal embedded performance
    Application throughput up to 50 Mbps
    Supports 4-bit SDIO and SPI host interfaces
    Bluetooth® Low Energy 5.2
    Bluetooth 5.2 supporting long-range and highspeed PHYs (up to 2 Mbps)
    Host controller interface (HCI) transport for Bluetooth with option for shared SDIO or UART
    Bluetooth Low Energy certified stack
    Integrated 2.4G-Hz PA for complete wireless solution with up to +20dBm output power
    Secured host interface
    Firmware authentication
    Anti-rollback protection
    Power Management
    VDD_1V8: 1.62V - 1.98 V
    VDD_3V3: 2.1 V - 4.2 V 
    Clock Source:
    40 MHz XTAL fast clock
    External 32.768-kHz slow clock by default
    65-QFM, 11-mm x 11-mm x 2-mm
    Regulatory (In Progress)
    Bluetooth SIG



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