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Bluetooth/WiFi Combo - BDE-BW3301NPxM2 (TI CC3301 2.4GHz Wi-Fi6 & BLE M.2 card, -40°C to 105°C)
  • BDE-BW3301NPxM2 (TI CC3301 2.4GHz Wi-Fi6 & BLE M.2 card, -40°C to 105°C)

  • General Description
     
    BDE-BW3301NPxM2 are 2.4-GHz Wi-Fi 6 and Bluetooth Low Energy Combo wireless M.2 card based on TI’s 10th generation connectivity combo chip CC3301 which are based upon proven technology and complements the TI integrated devices for connectivity portfolio. These modules are ideal for use in cost sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the peak throughput requirement is 50 Mbps maximum at the IP layer. BDE-BW3301NPxM2 could be the best choice for bringing the efficiency of Wi-Fi 6 to embedded device applications with a small PCB footprint and highly optimized bill of materials with lower cost. These modules integrates a BDE module (BDE-BW3301NP1 or BDE-BW3301NP2) on board, and provide a PCI Express M.2 interface to user, which are 2230 Key-E M.2 interface. They are designed for ease of use and integration to the embedded systems.

    These modules have two variants described as follows:
    BDE-BW3301NP1M2, single antenna port with U.FL connector;
    BDE-BW3301NP2M2, dual antenna port with U.FL connector, supports antenna diversity.

    Key Features
     
    Highly optimized Wi-Fi 6 and Bluetooth Low Energy 5.4 system for low cost embedded IoT applications 
    Seamless integration with TI SitaraTM MPU (Linux) / MCU+ (FreeRTOS) as well as other application processors 
    3-wire or 1-wire PTA for external coexistence with additional 2.4GHz radios (e.g. Thread or Zigbee) 
    Multirole support e.g. STA and AP to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)
    Optional antenna diversity or selection (BDE-BW3301NP2M2) 
    Operating temperature: -40°C to +85°C
    Wi-Fi 6®
    MAC, Baseband and RF Transceiver with support for IEEE 802.11 a/b/g/n/ax Wi-Fi6
    Medium access controller (MAC)
    Hardware-based encryption and decryption using supporting WPA2 and WPA3
    TWT and OFDMA for optimal embedded performance
    Application throughput up to 50 Mbps
    Supports 4-bit SDIO and SPI host interfaces
    Bluetooth® Low Energy 5.4
    Bluetooth 5.4 supporting long-range and highspeed PHYs (up to 2 Mbps)
    Host controller interface (HCI) transport for Bluetooth with option for shared SDIO or UART
    Bluetooth Low Energy certified stack
    Integrated 2.4G-Hz PA for complete wireless solution with up to +20dBm output power
    Security
    Secured host interface
    Firmware authentication
    Anti-rollback protection
    Power Management
    VDD_1V8: 1.62 V - 1.98 V
    VDD_3V3: 2.1 V - 4.2 V 
    Clock Source:
    On board 40 MHz XTAL fast clock
    External 32.768-kHz slow clock by default
    Interface and Form Factor
    PCI Express M.2 standard – 2230 Key-E
    22 mm x 30 mm x 2.8 mm
    Regulatory (In Progress)
    FCC
    IC
    CE-RED
    Bluetooth SIG

    Download:

    Datasheet:



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