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Bluetooth/WiFi Combo - BDE-BW3300NPxM2 series (TI CC3300 2.4GHz Wi-Fi6 M.2 card, -40°C to 105°C)
  • BDE-BW3300NPxM2 series (TI CC3300 2.4GHz Wi-Fi6 M.2 card, -40°C to 105°C)

  • General Description
     
    BDE-BW3300NPxM2 is a 2.4-GHz Wi-Fi 6 and Bluetooth Low Energy Combo wireless M.2 card based on TI’s 10th generation connectivity combo chip CC3300 which is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This module is ideal for use in cost sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the peak throughput requirement is 50 Mbps maximum at the IP layer. BDE-BW3300NPxM2 could be the best choice for bringing the efficiency of Wi-Fi 6 to embedded device applications with a small PCB footprint and highly optimized bill of materials with lower cost. The module integrates a BDE module (BDE-BW3300NP1 or BDE-BW3300NP2) on board, and provides a PCI Express M.2 interface to user, which is 2230 Key-E M.2 interface. It is designed for ease of use and integration to the embedded systems.

    This module has two variants described as follows:
    BDE-BW3300NP1M2, single antenna port with U.FL connector;
    BDE-BW3300NP2M2, dual antenna port with U.FL connector, supports antenna diversity.

    Key Features
     
    Highly optimized Wi-Fi 6 and Bluetooth Low Energy 5.2 system for low cost embedded IoT applications 
    Seamless integration with TI SitaraTM MPU (Linux) / MCU+ (FreeRTOS) as well as other application processors 
    3-wire or 1-wire PTA for external coexistence with additional 2.4GHz radios (e.g. Thread or Zigbee) 
    Multirole support e.g. STA and AP to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)
    Optional antenna diversity or selection (BDE-BW3300NP2M2) 
    Operating temperature: -40°C to +85°C
    Wi-Fi 6®
    MAC, Baseband and RF Transceiver with support for IEEE 802.11 a/b/g/n/ax Wi-Fi6
    Medium access controller (MAC)
    Hardware-based encryption and decryption using supporting WPA2 and WPA3
    TWT and OFDMA for optimal embedded performance
    Application throughput up to 50 Mbps
    Supports 4-bit SDIO and SPI host interfaces
    Bluetooth® Low Energy 5.2
    Bluetooth 5.2 supporting long-range and highspeed PHYs (up to 2 Mbps)
    Host controller interface (HCI) transport for Bluetooth with option for shared SDIO or UART
    Bluetooth Low Energy certified stack
    Integrated 2.4G-Hz PA for complete wireless solution with up to +20dBm output power
    Security
    Secured host interface
    Firmware authentication
    Anti-rollback protection
    Power Management
    VDD_1V8: 1.62 V - 1.98 V
    VDD_3V3: 2.1 V - 4.2 V 
    Clock Source:
    On board 40 MHz XTAL fast clock
    External 32.768-kHz slow clock by default
    Interface and Form Factor
    PCI Express M.2 standard – 2230 Key-E
    22 mm x 30 mm x 2.8 mm
    Regulatory (In Progress)
    FCC
    IC
    CE-RED
    Bluetooth SIG

    Applications
     
    Grid Infrastructure 
    Electricity Meter
    String Inverter 
    Micro Inverter 
    Energy Storage Power Conversion System (PCS) 
    Building and Home Automation
    HVAC Controller 
    HVAC Gateway 
    Thermostat 
    Building Security Gateway 
    Garage door system 
    IP network camera/ Video doorbell 
    Wireless security camera 
    Appliances
    Refrigerator & freezer 
    Oven 
    Washer & dryer 
    Residential water heater & heating system 
    Air purifier & humidifier 
    Coffee machine 
    Air conditioner indoor unit 
    Vacuum robot 
    Robotic lawn mower
    Medical
    Infusion pump 
    Electronic hospital bed & bed control 
    Multiparameter patient monitor 
    Blood glucose monitor 
    Blood pressure monitor 
    CPAP machine 
    Telehealth systems 
    MRI 
    Ultrasound scanner 
    Ultrasound smart probe 
    Electric toothbrush 
    Retail Automation and Payment


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