BDE-BW3300NPxM2 series (TI CC3300 2.4GHz Wi-Fi6 M.2 card, -40°C to 105°C）-BDE Technology Inc.

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Bluetooth/WiFi Combo - BDE-BW3300NPxM2 series (TI CC3300 2.4GHz Wi-Fi6 M.2 card, -40°C to 105°C）

BDE-BW3300NPxM2 series (TI CC3300 2.4GHz Wi-Fi6 M.2 card, -40°C to 105°C）
General Description

BDE-BW3300NPxM2 is a 2.4-GHz Wi-Fi 6 and Bluetooth Low Energy Combo wireless M.2 card based on TI’s 10th generation connectivity combo chip CC3300 which is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This module is ideal for use in cost sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the peak throughput requirement is 50 Mbps maximum at the IP layer. BDE-BW3300NPxM2 could be the best choice for bringing the efficiency of Wi-Fi 6 to embedded device applications with a small PCB footprint and highly optimized bill of materials with lower cost. The module integrates a BDE module (BDE-BW3300NP1 or BDE-BW3300NP2) on board, and provides a PCI Express M.2 interface to user, which is 2230 Key-E M.2 interface. It is designed for ease of use and integration to the embedded systems.

This module has two variants described as follows:
 BDE-BW3300NP1M2, single antenna port with U.FL connector;
 BDE-BW3300NP2M2, dual antenna port with U.FL connector, supports antenna diversity.

Key Features

 Highly optimized Wi-Fi 6 and Bluetooth Low Energy 5.4 system for low cost embedded IoT applications
 Seamless integration with TI SitaraTM MPU (Linux) / MCU+ (FreeRTOS) as well as other application processors
 3-wire or 1-wire PTA for external coexistence with additional 2.4GHz radios (e.g. Thread or Zigbee)
 Multirole support e.g. STA and AP to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)
 Optional antenna diversity or selection (BDE-BW3300NP2M2)
 Operating temperature: -40°C to +85°C
 Wi-Fi 6®
 MAC, Baseband and RF Transceiver with support for IEEE 802.11 a/b/g/n/ax Wi-Fi6
 Medium access controller (MAC)
 Hardware-based encryption and decryption using supporting WPA2 and WPA3
 TWT and OFDMA for optimal embedded performance
 Application throughput up to 50 Mbps
 Supports 4-bit SDIO and SPI host interfaces
 Bluetooth® Low Energy 5.4
 Bluetooth 5.4 supporting long-range and highspeed PHYs (up to 2 Mbps)
 Host controller interface (HCI) transport for Bluetooth with option for shared SDIO or UART
 Bluetooth Low Energy certified stack
 Integrated 2.4G-Hz PA for complete wireless solution with up to +20dBm output power
 Security
 Secured host interface
 Firmware authentication
 Anti-rollback protection
 Power Management
 VDD_1V8: 1.62 V - 1.98 V
 VDD_3V3: 2.1 V - 4.2 V
 Clock Source:
 On board 40 MHz XTAL fast clock
 External 32.768-kHz slow clock by default
 Interface and Form Factor
 PCI Express M.2 standard – 2230 Key-E
 22 mm x 30 mm x 2.8 mm
 Regulatory (In Progress)
 FCC
 IC
 CE-RED
 Bluetooth SIG

Download:

Datasheet

BDE-BW3300NxM2_Datasheet_V0.1.pdf
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