- BDE-MB1354P102(Multi-Band with PA Based on CC1354P10)
-
- General Description
The BDE-MB1354P102 is a multi-band (Sub-1 GHz and 2.4 GHz), multi-protocol wireless module series with an integrated PA in the 2.4 GHz band, based on Texas Instruments’ (TI) single-chip wireless microcontroller (MCU) CC1354P106T0RGZ. To meet different integration requirements, BDE offers multiple variants of this module series, as listed and described in Table 1.
The BDE-MB1354P102 integrates an Arm® Cortex®-M33 MCU and a dedicated software-controlled radio controller (Arm® Cortex®-M0). This architecture supports multiple physical layers and RF standards, including Thread, Zigbee®, Bluetooth® 5.2 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty, Wi-SUN, Amazon Sidewalk, proprietary systems, and TI 15.4-Stack for both Sub-1 GHz and 2.4 GHz bands. Concurrent multiprotocol operation is enabled through TI’s Dynamic Multiprotocol Manager (DMM) driver. The module features 1024 KB flash, 256 KB SRAM, and 8 KB cache SRAM.
The module supports operation in the 861 – 1054 MHz and 2360 – 2500 MHz frequency bands, with up to +14 dBm TX power in the Sub-1 GHz band and +20 dBm TX power in the 2.4 GHz band.
The BDE-MB1354P102 has an ultra-low sleep current of 0.98 μA with RTC and 256 KB RAM retention, enabling long battery life for wireless applications. In addition to the main Cortex®-M33 processor, it includes an autonomous ultra-low-power Sensor Controller CPU with fast wake-up capability. For example, the sensor controller can perform 1 Hz ADC sampling at 1 μA system current. The device offers low SER (Soft Error Rate) FIT (Failure-In-Time) for long operational lifetime, and always-on RAM parity minimizes corruption risk from potential radiation events.
Optimized for low-power wireless communication and advanced sensing, the module is well-suited for grid infrastructure, building automation, retail automation, personal electronics, and medical applications.
The series integrates all required system-level components — including clocks, balun filter, passives, and a PCB trace antenna or U.FL connector — into a compact PCB form factor, ensuring easy assembly and low-cost PCB design.
Pre-certified with FCC, ISED, CE, and Bluetooth SIG, the BDE-MB1352P72 enables quick integration and fast time-to-market for customer products.
Key Features
Wireless microcontroller Powerful 48-MHz Arm® Cortex®- M33 processor with TrustZone® FPU and DSP extension 1024 KB flash program memory 8 KB of cache SRAM 256 KB of ultra-low leakage SRAM with parity for high-reliability operation 32 kB of additional SRAM is available if parity is disabled Dual-band Sub-1GHz and 2.4GHz operation Dynamic multiprotocol manager (DMM) driver Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC Supports over-the-air upgrade (OTA) Ultra-low power sensor controller Autonomous MCU with 4 KB of SRAM Sample, store, and process sensor data Fast wake-up for low-power operation Software defined peripherals, capacitive touch, flow meter, LCD Low power consumption MCU consumption: 3.4 mA active mode, CoreMark® 71 μA/MHz running CoreMark® 0.98 μA standby mode, RTC, 256 KB RAM 0.17 μA shutdown mode, wake-up on pin Ultra low-power sensor controller consumption: 32 μA in 2 MHz mode 849 μA in 24 MHz mode Radio Consumption: 5.8 mA RX at 868 MHz 6.9 mA RX at 2.4 GHz 9.6 mA TX at +5 dBm at 2.4 GHz 25.8 mA TX at +14 dBm at 868 MHz 101 mA TX at +20 dBm at 2.4 GHz Wireless protocol support Thread, Zigbee®, Matter Bluetooth® 5.2 Low Energy Wi-SUN Mioty Amazon Sidewalk Wireless M-Bus SimpleLink™ TI 15.4-stack (Sub-1GHz) 6LoWPAN Proprietary systems High performance radio –121 dBm for 2.5 kbps long-range mode –110 dBm at 50 kbps, 802.15.4, 868 MHz –104 dBm for Bluetooth® Low Energy 125 kbps –105 dBm for IEEE 802.15.4-2006 2.4 GHz OQPSK (coherent modem) Output power up to +20 dBm with temperature compensation MCU peripherals Most digital peripherals can be routed to any GPIO Four 32-bit or eight 16-bit general-purpose timers 12-bit SAR ADC, 200 ksps, 8 channels 8-bit DAC Two comparators Programmable current source Four UART, four SPI, two I2C, I2S Real-time clock (RTC) Integrated temperature and battery monitor 26 GPIOs – none SPI flash versions 22 GPIOs – SPI flash versions Security enablers Supports secure boot Supports secure key storage and device ID Arm® TrustZone® for trusted execution environment AES 128- and 256-bit cryptographic accelerator Public key accelerator SHA2 Accelerator (full suite up to SHA-512) True random number generator (TRNG) Secure debug lock Software anti-rollback protection Operating range On-chip buck DC/DC converter 1.8-V to 3.8-V single supply voltage 2.3-V to 3.6-V single supply voltage (SPI flash variants) -40 to +85°C or -40 to +105°C Antenna options ANT pin for external antenna (Sub-1GHz & 2.4GHz) U.FL connector for external antenna (Sub-1GHz & 2.4GHz) Integrated PCB trace antenna (2.4GHz) On-board SPI Flash 32-Mbit, only available in SPI flash versions Package LCC-42, 26 mm x 19 mm x 2.15 mm RoHS-compliant package Certification FCC ID: 2ABRU-MB13P2 IC: 25657-MB13P2 CE-RED Bluetooth SIG - Pre: BDE-MB1352P72 (Muti-Band, Muti-Protocol with PA Based on CC1352P7)
