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Multi-Protocol - BDE-MP2652P7(Multi-Protocol with PA Based on CC2652P7)
  • BDE-MP2652P7(Multi-Protocol with PA Based on CC2652P7)

    BDE-MP2652P7 is a multiprotocol 2.4-GHz wireless module series consisting of CC2652P74T0RGZ single-chip wireless microcontroller (MCU). This series provides six options. Customer can choose the suitable version for different application scenario.
    BDE-MP2652P7A32 (PCB antenna and on-board external 32M-bit flash)
    BDE-MP2652P7U32 (U.FL connector and on-board external 32M-bit flash)
    BDE-MP2652P7N32 (RF pad out for antenna and on-board external 32M-bit flash)
    BDE-MP2652P7A0 (PCB antenna, no external flash) 
    BDE-MP2652P7U0 (U.FL connector, no external flash)
    BDE-MP2652P7N0 (RF pad out for antenna, no external flash)
    Created for the IoT, the BDE-MP2652P7 is a multiprotocol 2.4-GHz wireless module that integrates an Arm® Cortex®-M4 MCU, which supports Thread, Zigbee®, Matter, Bluetooth® 5.0 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), TI 15.4-Stack (2.4-GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. It optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

    The BDE-MP2652P7 supports operation in the 2360 to 2500-MHz frequency band. PHY and frequency switching can be done runtime through a dynamic multiprotocol manager (DMM) driver. It also has an integrated efficient power amplifier that supports +20 dBm output power in 2.4-GHz band, and a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.

    The BDE-MP2652P7 has a low sleep current of 0.9 μA with RTC and 144KB RAM retention. In addition to the main Cortex® M4F processor, the device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1-μA system current. And it has Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime. Always-on RAM parity minimizes risk for corruption due to potential radiation events. Consistent with many customers’ 10 to 15 years or longer life cycle requirements.

    The BDE-MP2652P7 highly integrates radio, stack, profile and applications in a SoC, without the need of using an external MCU. The module also offers flexible hardware interfaces for the sensor application. It enables ultra-low power connectivity and data transfer for the applications that are sensitive to power consumption, size and cost.

    Key Features
    Multiprotocol 2.4-GHz module consisting of CC2652P74T0RGZ single-chip wireless microcontroller (MCU)
    Fully integrated module includes all required clocks and passives
    Wireless microcontroller
    Powerful 48-MHz Arm® Cortex®-M4F processor
    Integrated external serial 32M-bit Flash
    704KB flash program memory
    256KB of ROM for protocols and library functions
    8KB of cache SRAM
    144KB of ultra-low leakage SRAM with parity for high-reliability operation
    Dynamic multiprotocol manager (DMM) driver
    Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, Bluetooth®5.0 Low Energy, IEEE 802.15.4 PHY and MAC
    Supports over-the-air upgrade(OTA)
    Ultra-low power sensor controller
    Autonomous MCU with 4KB of SRAM
    Sample, store, and process sensor data
    Fast wake-up for low-power operation
    Software defined peripherals; capacitive touch, flow meter, LCD
    Low power consumption
    MCU consumption:
    3.10 mA active mode, CoreMark
    65 μA/MHz running CoreMark
    0.9 μA standby mode, RTC, 144KB RAM
    0.1 μA shutdown mode, wake-up on pin
    Ultra low-power sensor controller consumption:
    29.2 μA in 2 MHz mode
    799 μA in 24 MHz mode
    Radio Consumption:
    6.4 mA RX
    101 mA TX at +20 dBm
    Wireless protocol support
    Thread, Zigbee®, Matter
    Bluetooth®5.0 Low Energy
    SimpleLink™ TI 15.4-stack
    Proprietary systems
    High performance radio
    -104 dBm for Bluetooth® Low Energy 125-kbps
    Output power up to +20 dBm with temperature compensation
    Regulatory compliance (On-going)
    Bluetooth SIG
    MCU peripherals
    Digital peripherals can be routed to any GPIO
    Four 32-bit or eight 16-bit general-purpose timers
    12-bit ADC, 200 kSamples/s, 8 channels
    8-bit DAC
    Two comparators
    Programmable current source
    Two UART, Two SSI, I2C, I2S
    Real-time clock (RTC)
    Integrated temperature and battery monitor
    Security enablers
    AES 128- and 256-bit cryptographic accelerator
    ECC and RSA public key hardware accelerator
    SHA2 Accelerator (full suite up to SHA-512)
    True random number generator (TRNG)
    Operating range
    On-chip buck DC/DC converter
    1.8-V to 3.8-V single supply voltage
    -40 to +85℃
    Dimension: 29.86 mm x 19.98 mm x 2.15 mm 
    QFM-42 (22 GPIOs)
    QFM-42 (26 GPIOs)
    RoHS-compliant package
    BDE-MP2652P7A32/BDE-MP2652P7A0: Integrated PCB antenna
    BDE-MP2652P7N32/BDE-MP2652P7N0: No antenna included, RF pad for connecting external antenna
    BDE-MP2652P7U32/BDE-MP2652P7U0: U.FL connector for connecting external antenna
    Additional integrated components:
    48.0-MHz crystal
    32.768-kHz crystal (RTC)
    32M-bit SPI Serial Flash
    RF filter, switch and passive components
    2400 to 2500 MHz ISM and SRD systems with down to 4 kHz of receive bandwidth
    Building automation
    Industrial transport – asset tracking
    Factory automation and control
    Electronic point of sale (EPOS) – Electronic Shelf Label (ESL)
    Communication equipment
    Personal electronics

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