- BDE-MP2651P3(Multi-Protocol with PA Based on CC2651P3)
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- General Description
The BDE-MP2651P3 is a high-performance 2.4 GHz multi-protocol wireless module series with integrated PA that supports up to 20dBm TX power. It is based on Texas Instruments’ (TI) single-chip wireless microcontroller (MCU) CC2651P31T0RGZR. To meet different integration requirements, BDE offers multiple variants of this module series, as listed and described in Table 1.
The BDE-MP2651P3 integrates a powerful 48-MHz Arm® Cortex®-M4 processor and a dedicated software-controlled radio controller (Arm® Cortex®-M0). This architecture supports multiple physical layers and RF standards, including Thread, Zigbee®, Bluetooth® 5.2 Low Energy, IEEE 802.15.4g, proprietary systems, and TI 15.4-Stack (2.4 GHz). Concurrent multiprotocol operation is enabled through TI’s Dynamic Multiprotocol Manager (DMM) driver. The module features 352 KB flash, 32 KB SRAM, and 8 KB cache SRAM.
The BDE-MP2651P3 has an ultra-low sleep current of 0.8 μA with RTC and 32 KB RAM retention, enabling long battery life for wireless applications.
The series integrates all required system-level components — including clocks, balun filter, passives, and a PCB trace antenna or U.FL connector — into a compact PCB form factor, ensuring easy assembly and low-cost PCB design.
Pre-certified with FCC, ISED, CE, and Bluetooth SIG, the BDE-MP2652P7 enables quick integration and fast time-to-market for customer products.
Table 1. Module VariantsPart Number
Antenna Type
On-board SPI Flash (Mbit)
Operating Temperature
BDE-MP2651P3A32
PCB trace antenna
32
-40℃ to +85℃
BDE-MP2651P3U32
U.FL connector
BDE-MP2651P3N32
ANT pin
BDE-MP2651P37A0
PCB trace antenna
0
BDE-MP2651P37U0
U.FL connector
BDE-MP2651P3N0
ANT pin
BDE-MP2651P3A32-IN
PCB trace antenna
32
-40℃ to +105℃
BDE-MP2651P3U32-IN
U.FL connector
BDE-MP2651P3N32-IN
ANT pin
BDE-MP2651P3A0-IN
PCB trace antenna
0
BDE-MP2651P3U0-IN
U.FL connector
BDE-MP2651P3N0-IN
ANT pin
Key Features
Wireless microcontroller
Powerful 48-MHz Arm® Cortex®-M4 processor
352KB flash program memory
32KB of ultra-low leakage SRAM
8KB of Cache SRAM
Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, Bluetooth 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
Supports over-the-air upgrade (OTA)
Low power consumption
MCU consumption:
2.91 mA active mode, CoreMark®
61 μA/MHz running CoreMark®
0.8 μA standby mode, RTC, 32 KB RAM
0.1 μA shutdown mode, wake-up on pin
Radio Consumption:
6.4 mA RX
7.1 mA TX at +0 dBm
9.5 mA TX at +5 dBm
22 mA TX at +10 dBm
101 mA TX at +20 dBm
Wireless protocol support
Bluetooth® 5.2 Low Energy Zigbee®
Proprietary systems SimpleLink™ TI 15.4-stack
High performance radio
-104 dBm for Bluetooth® Low Energy 125-kbps
Output power up to +20 dBm with temperature compensation
Bluetooth SIG
MCU peripherals
Most digital peripherals can be routed to any GPIO
Four 32-bit or eight 16-bit general-purpose timers
12-bit SAR ADC, 200 kSamples/s, 8 channels
8-bit DAC
Analog Comparator
UART, SSI, I2C, I2S
Real-time clock (RTC)
Integrated temperature and battery monitor
26 GPIOs – none SPI flash versions
22 GPIOs – SPI flash versions
Security enablers
AES 128-bit cryptographic accelerator
True random number generator (TRNG)
Additional cryptography drivers available in Software Development Kit (SDK)
Operating range
On-chip buck DC/DC converter
1.8 V to 3.8 V single supply voltage
-40 to +85°C / -40 to +105°C
Antenna
PCB antenna – BDE-MP2651P3A
U.FL connector – BDE-MP2651P3U
ANT Pad – BDE-MP2651P3N
On-board SPI Flash
32-Mbit, only available in SPI flash versions
Package
Dimension: 26 mm x 19 mm x 2.15 mm
LCC-42
RoHS-compliant package
Certification
FCC ID: 2ABUR-MP26P
IC: 25657-MP26P
CE-RED
Bluetooth SIG
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