BDE-MP2674R10 (Multi-Protocol Based on CC2674R10)-BDE Technology Inc.

BDE-MP2674R10 is a high performance multiprotocol 2.4-GHz wireless module series based on Texas Instrument (TI)’s multiprotocol wireless microcontroller (MCU) CC2674R106T0RGZ. In order to fulfil different integration scenarios, we provide different variants for this module series. They are listed and described in Table 1.

BDE-MP2674R10 module series integrates an powerful 48-MHz Arm® Cortex®-M33 MCU and a dedicated software controlled radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards. It supports Thread, Zigbee®, Matter, Bluetooth® 5.3 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), proprietary systems including TI 15.4-Stack (2.4-GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, wired networking, portable electronics, and home theater & entertainment markets.

BDE-MP2674R10 module series can support +5 dBm output power and a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY. It is with low standby current of 0.92 μA with full 256 KB RAM retention that enables longer battery life wireless applications. The module series supports for ARM® TrustZone® based secure key storage, device ID and trusted functions; Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events. The device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1-μA system current.

BDE-MP2674R10 module series integrates all required system-level hardware components including clocks, balun filter, other passives, and PCB trace antenna or U.FL connector into a small PCB form factor. It is for easy assembly and low-cost PCB design. It can work standalone with integrated powerful Arm® Cortex®-M33 for a wide range of applications without the need of external MCU. With its best-in-class radio performance, ultra-low power, small form factor and low cost, the BDE-MP2674R10 module series is the best choice for the applications that are sensitive to power consumption, size and cost.

Table 1. Module Variants

Orderable Part Number	Antenna Option	Integrated On-board SPI Flash	Operating Temperature
BDE-MP2674R10A32	PCB trace antenna	32-Mbit	-40℃ to +85℃
BDE- MP2674R10U32	U.FL connector	32-Mbit	-40℃ to +85℃
BDE- MP2674R10N32	ANT pin	32-Mbit	-40℃ to +85℃
BDE- MP2674R10A0	PCB trace antenna	Not included	-40℃ to +85℃
BDE- MP2674R10U0	U.FL connector	Not included	-40℃ to +85℃
BDE- MP2674R10N0	ANT pin	Not included	-40℃ to +85℃

Key Features

 Wireless microcontroller

 Powerful 48-MHz Arm® Cortex®- M33 processor with TrustZone®

 FPU and DSP extension
 1024 KB flash program memory
 8 KB of cache SRAM
 256 KB of ultra-low leakage SRAM with parity for high-reliability operation

 32 kB of additional SRAM is available if parity is disabled

 Integrated 32-Mbit SPI flash

 BDE-MP2674R10A32
 BDE- MP2674R10U32
 BDE- MP2674R10N32

 Dynamic multiprotocol manager (DMM) driver
 Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.3 Low Energy, IEEE 802.15.4 PHY and MAC
 Supports over-the-air upgrade (OTA)

 Ultra-low power sensor controller

 Autonomous MCU with 4 KB of SRAM
 Sample, store, and process sensor data
 Fast wake-up for low-power operation
 Software defined peripherals, capacitive touch, flow meter, LCD

 Low power consumption

 MCU consumption:

 4.0 mA active mode, CoreMark®
 83 μA/MHz running CoreMark®
 1.19 μA standby mode, RTC, 256 KB RAM
 0.13 μA shutdown mode, wake-up on pin

 Ultra low-power sensor controller consumption:

 30 μA in 2 MHz mode
 809 μA in 24 MHz mode

 Radio Consumption:

 6.4 mA RX
 7.3 mA TX at 0 dBm
 9.8 mA TX at +5 dBm

 Wireless protocol support

 Thread, Zigbee®, Matter
 Bluetooth® 5.3 Low Energy
 SimpleLink™ TI 15.4-stack
 6LoWPAN
 Proprietary systems

 High performance radio

 -104 dBm for Bluetooth® Low Energy 125-kbps
 –105 dBm for IEEE 802.15.4-2006 2.4 GHz OQPSK (coherent modem)

 Qualification and Regulatory

 Bluetooth SIG
 FCC
 IC
 CE-RED

 MCU peripherals

 Most digital peripherals can be routed to any GPIO
 Four 32-bit or eight 16-bit general-purpose timers
 12-bit SAR ADC, 200 kSamples/s, 8 channels
 8-bit DAC
 Two comparators
 Programmable current source
 Four UART, four SPI, two I2C, I2S
 Real-time clock (RTC)
 Integrated temperature and battery monitor
 31 GPIOs – none SPI flash versions
 27 GPIOs – SPI flash versions

 Security enablers

 Supports secure boot
 Supports secure key storage and device ID
 Arm TrustZone for trusted execution environment
 AES 128- and 256-bit cryptographic accelerator
 ECC and RSA public key hardware accelerator
 SHA2 Accelerator (full suite up to SHA-512)
 True random number generator (TRNG)
 Secure debug lock
 Software anti-rollback protection

 Operating range

 On-chip buck DC/DC converter
 1.8 V to 3.8 V single supply voltage – None SPI flash variants
 2.3V to 3.8V single supply voltage- SPI flash variants
 -40 to +85°C

 Package

 Dimension: 21.5 mm x 15 mm x 2.15 mm
 LCC-36 – BDE-MP2674R10A
 LCC-39 – BDE-MP2674R10U and BDE-MP2674R10N
 RoHS-compliant package

 Antenna

 Integrated ceramic chip antenna: BDE- MP2674R10A32/BDE- MP2674R10A0
 Integrated U.FL connector for connecting external antenna: BDE- MP2674R10U32/BDE- MP2674R10U0
 ANT pin out for connecting external antenna - BDE- MP2674R10N32/BDE- MP2674R10N0

 Additional integrated components

 48.0-MHz HFXT
 32.768-kHz LFXT
 32-Mbit SPI flash

 BDE- MP2674R10A32
 BDE- MP2674R10U32
 BDE- MP2674R10N32

 RF filter and passive components

Download

Datasheet:

BDE-MP2674R10_Datasheet_V02.pdf

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