BDE-BW3551 module series is a 2.4GHz and 5GHz dual-band Wi-Fi 6 and Bluetooth 5.4 Low Energy wireless MCU module based on TI's SimpleLink™ Wi-Fi
SoC (system-on-chip) CC3551E.
The
module series offers the latest standards from Wi-Fi and Bluetooth Low Energy
while maintaining compatibility with Wi-Fi 4 (802.11 a/b/g/n) and Wi-Fi 5
(802.11 ac).
The module series is an excellent choice to use in cost-sensitive embedded applications with RTOS software, bringing the efficiency of Wi-Fi 6 to embedded
device applications for the Internet
of Things (IoT), with a compact PCB footprint
and highly optimized bill of materials.
Microcontroller
• Powerful
160MHz Arm®Cortex®-M33 processor with FPU, TrustZone®, and AI acceleration
• High-speed
quad-SPI for XiP flash with on-the-fly decryption
• Flexible
configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for
improved code execution performance
• 1.1MB
embedded SRAM including 128KB TCM for Wi-Fi™, Bluetooth® Low Energy,
networking, and ap-plication data
Peripherals
• Up
to 27 I/Os with flexible multiplexing options
• 8x
general-purpose timers and pulse-width modulation (PWM)
• 3x
universal asynchronous receiver-transmitter (UART)
• 2x
Serial Peripheral Interface (SPI)
• 2x
inter-integrated circuit (I2C)
• Inter-IC sound (I2S)
• Pulse
density modulation (PDM)
• Secure
digital and multimedia card (SD/MMC)
• Secure
digital input output (SDIO) 2.0
• Controller
area network (CAN) 2.0
• 8-channel,
12-bit analog-to-digital converter (ADC) System Services
• Direct
memory access (DMA)
• One-time-programmable
memory (OTP)
• Real-time
clock (RTC) and watchdog timer (WDT)
Radio
• Wi-Fi
6 (802.11ax)
◦ 2.4GHz
and 5GHz, single-stream 20MHz channels with application throughput up to 20Mbps
(UDP)
◦ Compatible
with IEEE 802.11 a/b/g/n/ax
▪ Orthogonal
frequency-division multiple access (OFDMA)
▪ Target
wake time (TWT)
▪ Trigger
frames
▪ Basic
service set (BSS) color
◦ Integrated
PA for a complete WLAN system with up to 18 dBm output power at 1 DSSS
◦ Role
support: STA, softAP , Wi-Fi direct, multi-role AP + STA
◦ Support
for personal and enterprise Wi-Fi security: WPA and WPA2 PSK, WPA2 Enterprise,
WPA3 personal or enterprise
◦ Wi-Fi
TX Power:
▪ 18
dBm at 1DSSS
▪ 16
dBm at 54OFDM
◦ Wi-Fi
RX Sensitivity:
▪ –96
dBm at 1DSSS
▪ –74
dBm at 54OFDM
• Bluetooth®
Low Energy
◦ Bluetooth
Low Energy 5.4 certified stack
◦ Supports
long-range and high-speed PHYs (up to 2Mbps)
Security Features
• ARM
TrustZone
• Hardware
security module supporting all of the following:
◦ ECC,
RSA, AES, SHA2/3, MD5, CRC 16/32, and TRNG
◦ Secure
key storage
• Initial
secure programming
• Secure
boot
• Software
IP and cloning protection
• Debug
security through JTAG and debug port lock
• OTP
with the ability to program root-of-trust public key
• Secure
over-the-air (OTA) updates
• Anti-rollback
protection Clock Source
• Fast
clock: 52MHz XTAL
• Slow
clock: Internal low-frequency oscillator, external 32.768kHz XTAL, or external
slow clock source Power Management
• Support
for 3.3V and 1.8V on multiple I/O domains
• Supplies:
◦ VDD_3V3:
3.3V
◦ VDD_1V8:
1.8V
◦ VDD_SF:
1.8V
◦ VIO1:
1.8/3.3V
◦ VIO2:
1.8/3.3V (Must be set to 1.8V for PSRAM variants)
Key Benefits
• Complete
software development kit with open-source TCP/IP and TLS stacks
• Operating
temperature: –40°C to +85°C
• Support
for 3-wire PTA coexistence interface for use with external 2.4GHz radios (for
example Thread or Zigbee®)
• Antenna
selection capability
Memory
• Up
to 8MB XiP flash Antenna Options
• Integrated
PCB trace antenna
• U.FL
connector
• ANT
pin
Package
• LGA-73,
14mm x 17.6mm x 2mm, PCB trace antenna variants
• LGA-73,
14mm x 16mm x 2mm, U.FL connector variants
• LGA-73, 14mm x 12.6mm x 2mm, ANT pin variants
Certifications - In-progress
• Bluetooth
SIG
• FCC
• IC
• MIC
• CE-RED