BDE-MP2755P10 is a Bluetooth® Low Energy (6.x and the upcoming versions), Zigbee (3.0 and the upcoming versions), Thread (1.3 and the upcoming versions), Matter (1.2 and the upcoming versions) and Proprietary 2.4-GHz wireless module series based on Texas Instrument (TI)’s single-chip wireless microcontroller (MCU) CC2755P10. In order to fulfil different integration scenarios, we provide different variants for this module series. 

BDE-MP2755P10 module series integrates an Arm® Cortex®-M33 MCU, which supports Bluetooth® 6.0 Low Energy, ZigBee®, Thread and Proprietary 2.4GHz systems. This device is optimized for low-power wireless communication with Over the Air Download (OAD) support in building automation (wireless sensors, lighting control, beacons), appliances, asset tracking, medical, and personal electronics (toys, HID, stylus pens) markets.

BDE-MP2755P10 module series can support up to +20 dBm output power and a receive sensitivity of -103.5 dBm for 125 kbps Bluetooth® Low Energy Coded PHY. The module series supports for Bluetooth 6.0 and earlier version features: LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement Sets, CSA#2, as well as backward compatibility with earlier Low Energy specifications, Bluetooth® Channel Sounding technology and Algorithm Processing Unit (APU) to enable high accuracy, low cost, and secure phase-based ranging mechanism for distance estimation.

The module series have advanced security for connected wireless MCUs, and with ultra-low standby current with full 162KB RAM retention and RTC operation that enables significant battery life extension especially for applications with longer sleep intervals.

BDE-MP2755P10 module series highly integrates the radio with required passives, high-frequency clock, low-frequency clock, filter, antenna, etc., and also a fully-qualified Bluetooth® 6.0 software protocol stack and profiles from TI. It can work standalone without using an external MCU. With its best-in-class radio performance, ultra-low power, small form factor and low cost, the BDE-MP2755P10 module series is the best choice for the applications that are sensitive to power consumption, size and cost.

The module series is pre-certified with FCC, ISED, CE and Bluetooth SIG to make easy integration and fast time-to-market for customers.

    Wireless MCU Processing Elements

    Arm® Cortex®-M33 processor (96MHz) with FPU (floating point unit), TrustZone®-M support and CDE (custom datapath extension) for machine learning acceleration

    Algorithm Processing Unit (APU) (96MHz)

    Mathematical accelerator for efficient vector and matrix operations

    Bluetooth® 6.0 Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms like MUSIC (MUltiple SIgnal Classification)

    Wireless MCU Memory

    Up to 1MB of in-system programmable flash

    Up to 162KB of SRAM

    32KB of System ROM with secure boot root of trust (ROT) and a serial (SPI/UART) bootloader

    Serial wire debug (SWD)

    MCU peripherals

    Up to 23 I/O Pads

    2 IO pads SWD, multiplexed with GPIOs

    2 IO pads LFXT, multiplexed with GPIOs (On-board LFXT populated by default, these two IOs are not exposed by default)

    19 DIOs (analog or digital IOs)

    All GPIOs with wakeup and interrupt capabilities

    3x 16-bit or 1x 32-bit general-purpose timers, quadrature decode mode support

    Real-time clock (RTC)

    Watchdog timer

    System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing

    12-bit ADC, up to 1.2 Msps, 8 external inputs

    Temperature sensor and battery monitor

    1x low power comparator

    2x UART with LIN capability

    2x SPI

    1x I2C

    1x I2S

    Security enablers

    Global Platform SESIP (Security Evaluation Standard for IoT Platforms) Level 3 and Arm PSA (Platform Security Architecture) Level 3 Certification

    Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:

    AES (up to 256 bits) crypto accelerator

    ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator

    SHA-2 (up to 512 bits) accelerator

    True random number generator

    HSM firmware update support

    Separate AES 128bit crypto accelerator (LAES) for latency-critical link-layer crypto operations

    Secure boot and secure firmware updates

    Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation

    Voltage glitch monitor (VGM)

    Low power consumption

    MCU consumption:

    6.8 mA active mode, MCU 96MHz (CoreMark®)

    0.9 uA Standby (low power mode), RTC on, full RAM retention

    160 nA Reset or Shutdown

    Radio Consumption:

    6.1 mA RX

    7.7 mA TX at +0 dBm

    128 mA TX at +20 dBm

    Wireless protocol support

    Bluetooth® 6.x Low Energy

    Support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)

    Zigbee®

    Thread

    Matter

    Proprietary systems

    High performance radio

    -103.5 dBm for Bluetooth® LE 125 kbps

    -97 dBm for Bluetooth® LE 1 Mbps

    -103 dBm for IEEE 802.15.4 (2.4 GHz)

    Output power up to +20 dBm

    Operating range

    1.71-V to 3.8-V single supply voltage

    2.3-V to 3.6-V single supply voltage (SPI flash variants)

    Operating temperature range:

    -40℃ to +85℃

    -40℃ to +105℃ (-IN variants)

    Package

    Dimension:

    14 mm x 17 mm x 2.2 mm

    RoHS-compliant package

    Antenna

    BDE-MP2755P10A variants: Integrated PCB Trace antenna

    BDE-MP2755P10U variants: U.FL connector for external antenna

    BDE-MP2755P10N variants: ANT pin for external antenna

    Additional integrated components

    48.0-MHz HFXT

    32.768-kHz LFXT

    32-Mbit SPI flash

    BDE-MP2755P10X32(-IN)

    RF filter and passive components

    Regulatory compliance (On-going)

    FCC ID: 2ABRU-MP2755P10

    IC: 25657-MP2755P10

    CE-RED

    Bluetooth SIG